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MT29F2G08ABAGAWP-IT

Orderable parts

MT29F2G08ABAGAWP-IT:G

Specs

  • Chipset Validation
    N/A
  • Density
    2Gb
  • FBGA Code
    N/A
  • Op. Temp.
    -40C to +85C
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Width
    x8

Data Sheets

Errata: 2Gb Parallel NAND with ECC off

MT29F2G08ABAGAWP-IT:G, MT29F2G08ABAGAH4-IT:G, MT29F2G08ABBGAH4-IT:G
  • File Type: PDF
  • Updated: 2017-03-07

RoHS

China RoHS Certificate

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.
  • File Type: (PDF)
  • Updated: 2/1/2024

RoHS Certificate of Compliance

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.
  • File Type: (PDF)
  • Updated: 2/1/2024

REACH Statement

REACH Statement

Company statement regarding REACH SVHC compliance
  • File Type: (PDF)
  • Updated: 2/1/2024

Simulation Models

HSpice: NAND 2Gb SLC M79A

Rev 2.0, MT29F2G08ABAGAH4-IT:G, MT29F2G08ABAGAWP-IT:G, MT29F2G08ABBGAH4-IT:G, MT29F2G08ABAGAH4-ITE:G, MT29F2G08ABAGAWP-ITE:G, MT29F2G08ABBGAH4-ITE:G, MT29F2G08ABAGAWP-AAT:G
  • File Type: ZIP
  • Updated: 2019-03-25

IBIS: NAND 2Gb SLC M79A

Rev 2.0, MT29F2G08ABAGAH4-IT:G, MT29F2G08ABAGAWP-IT:G, MT29F2G08ABBGAH4-IT:G, MT29F2G08ABAGAH4-ITE:G, MT29F2G08ABAGAWP-ITE:G, MT29F2G08ABBGAH4-ITE:G, MT29F2G08ABAGAWP-AAT:G
  • File Type: ZIP
  • Updated: 2019-03-25

Technical Notes

TN-00-08: Thermal Applications

This tech note describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2022-08-09

TN-29-68: One-Time Programmable Operations in 2Gb: x8, x16 NAND Flash Memory

This technical note describes one-time programmable operations in Micron's 2Gb: x8, x16 NAND Flash memory devices.
  • File Type: PDF
  • Updated: 2016-08-16

TN-29-52: Migrating 1Gb 48nm and 2Gb/4Gb 57nm SLC NAND Flash Memory to 34nm

This technical note provides guidelines for migrating 1Gb 48nm and 2Gb/4Gb 57nm SLC, large-page NAND Flash memory to 34nm technology (M60A, M69A & M68A)
  • File Type: PDF
  • Updated: 2015-09-22
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2021-12-06

CSN-24: ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05
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