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Multichip Packages

Get the critical features and functions for your design—including high performance, high quality, power efficiency, wide density ranges, small package sizes, and industrial temperature ranges—from our broad portfolio of industry-standard multichip packages (MCPs).

By Technology

Technology Benefits Technology Package Density
UFS-Based MCP (uMCP) Embedded managed NAND and high-performance LPDRAM in a single package. Enables high-density, low-power storage in a small footprint. Mobile LPDDR4
Mobile LPDDR4X
UFS
3D NAND
WFBGA UFS: 32GB

LPDRAM: 24Gb (3GB)
e.MMC-Based MCP Embedded managed NAND and High Performance LPDRAM in a single package
Simplified software solutions for complex high density NAND applications
e.MMC

Mobile LPDDR2

Mobile LPDDR3

Mobile LPDDR4
PoP, WFBGA, VFBGA, TFBGA, LFBGA e.MMC: 4GB–32GB

LPDRAM: 4Gb–32Gb
NAND-Based MCP Offers high densities for data-intensive applications
Provides high speeds, with x8, x16 and x32 bus widths
Enables high reliability with SLC NAND that provides up to 100,000 PROGRAM/ERASE cycles
NAND Flash

Mobile LPDDR2

Mobile LPDDR

Mobile LPSDR
PoP, VFBGA, TFBGA NAND:  1Gb–8Gb

LPDRAM: 256Mb–4Gb
NOR-Based MCP Simplifies design while speeding performance for low-density applications
Reduces active ball count by more than 50% thanks to shared-bus and A/D MUX options
Speeds boot-up and extends battery life with execute-in-place (XIP) functionality
Supports low-voltage applications (1.8V)
Parallel NOR Flash

PSRAM

Mobile LPDDR
VFBGA, TFBGA NOR:  32Mb–512MB

PSRAM: 16Mb–128Mb

LPDDR: 512Mb

Resources

Technical Notes
This technical note presents a case study of a handset simulation in which an LPDRAM is stacked on an application processor (PoP) and the resulting thermal-profile modeling. This note also explains how thermal detection features included in LPDDR and LPDDR2 can be used to...
  • File Type: PDF
  • Updated: 07/26/2010