Micron HBM3E

Micron's 8-high and 12-high HBM3E memory further fuel AI innovation at 30% lower power consumption than competition. Micron 8-high 24GB will ship with NVIDIA H200 tensor Core GPUs in CQ2, 2024. Micron 12-high 36GB samples are now available.



With support of $6.1B CHIPS grant, Micron plans to invest $50 billion in gross capex for U.S. domestic leading-edge memory manufacturing through 2030

These grants will support construction of one leading-edge memory manufacturing fab in Boise, Idaho and the construction of two leading-edge memory fabs in Clay, New York. This is the first step in Micron's vision for a potential investment of up to $125 billion in leading-edge memory manufacturing over the next 20-plus years. These facilities are expected to create approximately 75,000 U.S. jobs, building supply chain resilience, and ensuring U.S. economic and national security that will drive America’s technology leadership.

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Markets & Industries

Memory and storage technology for industrial IoT

Micron's innovative portfolio of memory and storage technology helps create "smarter" IoT (internet of things) devices and supports a wide assortment of industries with an array of options. In addition, Micron devices work with a variety of applications like IoT gateways and edge servers, industrial automation, aerospace and defense and video security.


Advancing data center storage

Micron's advanced NAND based data center SSDs deliver extensive capacity and deployment options that enable flexible solution design for a variety of data center workloads. The world’s first 200+ layer data center SSD, the Micron 6500 ION NVMe™ SSD, delivers best-in-class performance, features 30.72TB of storage and enhanced security capabilities.

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