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Frequently asked questions
Micron’s HBM3E 8-high and 12-high modules deliver:
- An industry-leading pin speed of greater than 9.2Gbps and can support backward-compatible data rates of HBM2 first-generation devices,
- Bandwidth of more than 1.2 TB/s per placement.
- HBM3E 8-high provides 24GB capacity per placement and our HBM3E 12-high cube will deliver a jaw-dropping 36GB of capacity per placement.
Our SOCAMM module leverages Micron’s LPDDR5X technology with a proven track record of capacity, performance, and energy efficiency
Yes, our CZ122 memory expansion modules are based on the CXL standards.