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NAND-Based MCP

Whether you’re trying to minimize power consumption, maximize density, increase speed, or do everything at once, Micron’s NAND MCPs can drive your design no matter the application. Get the reliability your space-constrained design needs with our fully tested, stackable MCPs and PoPs in a variety of packages and technology options—and from a memory provider who manufactures all of the memory elements—including the NAND Flash and mobile LPDRAM.

By Density

NAND Density DRAM Type DRAM Density Pinout Voltage Package
16GB LPDDR3 8Gb, 16Gb n/a 3.3V, 1.8V VFBGA
1Gb LPDDR2, LPDDR 512Mb n/a, JEDEC 1.8V, 1.7V-1.9V WFBGA, VFBGA, TFBGA
2Gb LPDDR2, LPDDR 1Gb n/a, JEDEC 1.8V, 1.7V-1.9V WFBGA, VFBGA, TFBGA, n/a
4Gb LPDDR2, LPDDR 2Gb, 4Gb n/a, JEDEC, TI (OMAP) 1.8V, 1.7V-1.9V VFBGA, WFBGA, TFBGA
4GB LPDDR3, LPDDR2 8Gb, 4Gb n/a 3.3V VFBGA
8Gb LPDDR 4Gb n/a 1.7V-1.9V VFBGA
8GB LPDDR3, LPDDR2 8Gb n/a 3.3V VFBGA
View Full NAND-based MCP Part Catalog

By Application

Compact Footprint

Compact Footprint

Squeeze more performance into your space-constrained designs with stacked memory devices.

Reliability

Reliability

Rely on products that are rigorously tested and qualified through close collaboration with OEMs.

Featured Product

MCP

eMCP

>> See Products

Our eMCPs do more than meet the memory requirements of mid-tier phones and tablets. They save more than 40% space versus discrete memory—reducing the memory footprint, simplifying PCB design, and speeding time to market. Built on a foundation of Micron-manufactured e.MMC (MLC/TLC NAND + microcontroller) and LPDRAM, these JEDEC-compliant, footprint-compatible devices enable simple and flexible system design and certification.

Documentation

Frequently Asked Questions
Frequently asked questions (FAQs) about Micron's Multichip Packages.
  • Updated: 09/30/2015
Customer Service Note
The first section of this customer service note describes the product marks and labels we place on our devices. The second section describes the labels used on and in our packaging.
Search all NAND-Based MCP documentation
IBIS

J84F; MT29RZ4B2DZZHHWD-18I.84F, MT29RZ4B2DZZHHPS-18I.84F

Data Sheet

16GB (2 x L94C) e.MMC (PS8225 90s PB v5.1) and 16Gb LPDDR3 (2 x V01M) MT29TZZZ5D6EKFRL-107 W.96R (221b; J96R)

  • File Type: PDF
  • Updated: 04/12/2016

Resources

Search all NAND-Based MCP resources
Blog

As you’ve seen in the news in the last year; coming out of every major trade show there is another announcement about autonomous vehicles, also known as self-driving cars. We wanted to take a few minutes to explain Autonomous Driving progression, based on the SAE (Society of...

Blog

For most people, a wearable is synonymous with a smartwatch or a fitness monitor, devices that have grown over the years into mature products. While there continues to be room for innovation in each of these device categories, both have “crossed the chasm” – a marketing...

Brief

A high-level comparison of our broad portfolio of NAND and NOR MCPs.

Article

The Internet of Things (IoT) has created new requirements for memory in space- and resource-constrained applications that are adding connectivity where little to none existed before. In particular, the advent of the IoT is driving the use of multichip package (MCP) memory...