Add Bookmark(s)



Bookmark(s) shared successfully!

Please provide at least one email address.

Microchip background


Whether you’re trying to minimize power consumption, maximize density, increase speed, or do everything at once, Micron’s NAND MCPs can drive your design no matter the application. Get the reliability your space-constrained design needs with our fully tested, stackable MCPs and PoPs in a variety of packages and technology options—and from a memory provider who manufactures all of the memory elements—including the NAND Flash and mobile LPDRAM.

By Density

NAND Density DRAM Type DRAM Density Pin Count Voltage Package
1Gb LPDDR, LPDDR2 512Mb 130-ball, 137-ball, 121-ball 1.7V-1.9V, 1.8V VFBGA, TFBGA, WFBGA
2Gb LPDDR, LPDDR2 1Gb 130-ball, 137-ball, 162-ball 1.7V-1.9V, 1.8V VFBGA, TFBGA, n/a, WFBGA
4Gb LPDDR, LPDDR2, n/a 2Gb, 4Gb, n/a 168-ball, 137-ball, 130-ball, 162-ball, n/a 1.7V-1.9V, 1.8V, n/a WFBGA, VFBGA, n/a
8Gb LPDDR 4Gb 168-ball 1.7V-1.9V VFBGA
View Full NAND-based MCP Part Catalog

By Application

Compact Footprint

Compact Footprint

Squeeze more performance into your space-constrained designs with stacked memory devices.



Rely on products that are rigorously tested and qualified through close collaboration with OEMs.


Frequently Asked Questions
Frequently asked questions (FAQs) about Micron's Multichip Packages.
  • Updated: 09/30/2015
Customer Service Note
The first section of this customer service note describes the product marks and labels we place on our devices. The second section describes the labels used on and in our packaging.



Designers are increasingly turning to multichip package (MCP) solutions to achieve the smallest possible footprint while providing more density and better performance for IoT and M2M module designs.


A high-level comparison of our broad portfolio of e.MMC, and NAND MCPs.


A high-level comparison of our broad portfolio of NAND and e.MMC multichip package (MCP) memory solutions.


In late August, we announced our first ever mobile 3D NAND memory products, enabling our smartphone customers to pack in a lot more storage capacity into a smaller footprint. While bringing this new 3D architecture to mobile is significant, perhaps even more exciting was our...