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Micron Products

NAND-Based MCP

Whether you’re trying to minimize power consumption, maximize density, increase speed, or do everything at once, Micron’s NAND MCPs can drive your design no matter the application. Get the reliability your space-constrained design needs with our fully tested, stackable MCPs and PoPs in a variety of packages and technology options—and from a memory provider who manufactures all of the memory elements—including the NAND Flash and mobile LPDRAM.

By Density

NAND Density DRAM Type DRAM Density Pinout Voltage Package
16GB LPDDR3 8Gb, 16Gb n/a 3.3V, 1.8V VFBGA
1Gb LPDDR2, LPDDR, LPSDR 512Mb n/a, JEDEC 1.8V, 1.7V-1.9V WFBGA, VFBGA, TFBGA
2Gb LPDDR2, LPDDR 1Gb n/a, JEDEC 1.8V, 1.7V-1.9V WFBGA, VFBGA, TFBGA, n/a
4Gb LPDDR2, LPDDR 2Gb, 4Gb n/a, JEDEC, TI (OMAP) 1.8V, 1.7V-1.9V WFBGA, VFBGA, TFBGA
4GB LPDDR3, LPDDR2 8Gb, 4Gb n/a 3.3V VFBGA
8Gb LPDDR 4Gb n/a 1.7V-1.9V VFBGA
8GB LPDDR3, LPDDR2 8Gb n/a 3.3V VFBGA
View Full NAND-based MCP Part Catalog

By Application

Compact Footprint

Compact Footprint

Squeeze more performance into your space-constrained designs with stacked memory devices.

Reliability

Reliability

Rely on products that are rigorously tested and qualified through close collaboration with OEMs.

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Featured Products

MCP

eMCP

>> See Products

Our eMCPs do more than meet the memory requirements of mid-tier phones and tablets. They save more than 40% space versus discrete memory—reducing the memory footprint, simplifying PCB design, and speeding time to market. Built on a foundation of Micron-manufactured e.MMC (MLC/TLC NAND + microcontroller) and LPDRAM, these JEDEC-compliant, footprint-compatible devices enable simple and flexible system design and certification.

Documentation

Frequently Asked Questions
Frequently asked questions (FAQs) about Micron's Multichip Packages.
  • Updated: 09/30/2015
Customer Service Note
Explains product part marking, and product and packaging labels.
Search all NAND-Based MCP documentation
Data Sheet

8GB e.MMC and 8Gb LPDDR3 (V01M) MT29TZZZ8D5JKETS-107 W.95Q (168b; J95Q)

Customer Service Note


(CSN-11) Explains product part marking, and product and packaging labels.

Resources

Search all NAND-Based MCP resources
Brief

A high-level comparison of our broad portfolio of NAND and NOR MCPs.

Article

The Internet of Things (IoT) has created new requirements for memory in space- and resource-constrained applications that are adding connectivity where little to none existed before. In particular, the advent of the IoT is driving the use of multichip package (MCP) memory...

Brief

Designers are increasingly turning to multichip package (MCP) solutions to achieve the smallest possible footprint while providing more density and better performance for IoT and M2M module designs.

Brief

A high-level comparison of our broad portfolio of NAND and NOR MCPs.