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Whether you’re trying to minimize power consumption, maximize density, increase speed, or do everything at once, Micron’s NAND MCPs can drive your design no matter the application. Get the reliability your space-constrained design needs with our fully tested, stackable MCPs and PoPs in a variety of packages and technology options—and from a memory provider who manufactures all of the memory elements—including the NAND Flash and mobile LPDRAM.

By Density

NAND Density DRAM Type DRAM Density Pin Count Voltage Package
1Gb LPDDR2, LPDDR 512Mb 121-ball, 130-ball, 137-ball 1.8V, 1.7V-1.9V WFBGA, VFBGA, TFBGA
2Gb LPDDR2, LPDDR 1Gb 162-ball, 130-ball, 137-ball 1.8V, 1.7V-1.9V VFBGA, WFBGA, TFBGA, n/a
4Gb LPDDR2, LPDDR, n/a 2Gb, 4Gb, n/a 162-ball, 137-ball, 168-ball, 130-ball, n/a 1.8V, 1.7V-1.9V, n/a VFBGA, WFBGA, n/a
8Gb LPDDR 4Gb 168-ball 1.7V-1.9V VFBGA
View Full NAND-based MCP Part Catalog

By Application

Compact Footprint

Compact Footprint

Squeeze more performance into your space-constrained designs with stacked memory devices.



Rely on products that are rigorously tested and qualified through close collaboration with OEMs.


Frequently Asked Questions
Frequently asked questions (FAQs) about Micron's Multichip Packages.
  • Updated: 09/30/2015
Customer Service Note
The first section of this customer service note describes the product marks and labels we place on our devices. The second section describes the labels used on and in our packaging.



A high-level comparison of our broad portfolio of e.MMC, NAND and NOR MCPs.


A high-level comparison of our broad portfolio of NAND, NOR and e.MMC multichip package (MCP) memory solutions.


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MCP’s or Multi Chip Packages as they are commonly referred to in the memory industry, are single packages with multiple memory devices inside. While the traditional definition of an MCP could include packages with multiple die of the same technology (like DRAM, NOR or NAND),...