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A wide array of capabilities makes our DDR2 an excellent memory choice for the diverse needs of many applications—from automotive, networking and industrial to legacy consumer, server and computing. In fact, we’ve designed both the long-term roadmap and the product features of our DDR2 memory with those needs in mind.

By Density

Density Width Voltage Clock Rate Package Op. Temp.
4Gb x8, x4 1.8V 400 MHz FBGA 0C to +85C
2Gb x4, x8, x16 1.8V 400 MHz, 333 MHz FBGA 0C to +85C, -40C to +95C, -40C to +105C
1Gb x16, x8, x4 1.8V 400 MHz, 333 MHz, 533 MHz FBGA -40C to +125C, -40C to +105C, -40C to +95C, 0C to +85C
512Mb x16, x8, x4 1.8V 400 MHz, 533 MHz, 333 MHz FBGA -40C to 125C, -40C to +95C, 0C to +85C, -40C to +105C
View Full DDR2 Part Catalog

By Application



Enable better electrical performance and speed compared to DDR.


High Reliability

Withstand extreme temperatures with extended operating ranges.

High Density

Enable large memory subsystems with 256Mb to 4Gb densities, thanks to our dual-die package.

Low Power

Reduce power with our low 1.55V option.


Compatibility Guide

This overview shows Micron DRAM and Flash Memory valdiation and support for Xilinx Platforms.

Compatibility Guide

Micron® Flash & DRAM Memory Support for Ambarella® Platforms

  • File Type: PDF
  • Updated: 08/31/2016
Compatibility Guide

Micron® Flash & DRAM Memory Support for Altera® Platforms

  • File Type: PDF
  • Updated: 08/12/2016

Customer collateral describing the benefits of Product Lifecycle Solutions, including Standard Lifecycle Products and Product Longevity Program (PLP)

  • File Type: PDF
  • Updated: 07/06/2016