Move beyond processing power by choosing the right memory and storage technologies to give you more control over the essential systems that affect your business. We help you scale, simplify, consolidate and automate to get the maximum value out of your data center.
Micron's world-class high-capacity DIMM modules are fueling advances in AI, in-memory databases and data center servers around the world. Our 96GB high-capacity DIMMS are available and ready to be deployed. We are currently sampling, to ecosystem partners, our first-to-market, high-capacity 128GB RDIMMs that offer you the world's fastest, lowest latency modules for efficient processing of high memory-capacity applications. This high-speed DDR5 solution has resulted in an up to 28% improvement in AI inference performance.
Connect with our Sales Network to discuss your AI data center needs.
1Currently sampling to ecosystem partners.
The DDR5 Technical Enablement Program (TEP) is a program that offers a path into Micron to gain early access to technical information and support, electrical and thermal models as well as DDR5 products to aid in the design, development and bring-up of next-generation computing platforms.
tep program detailsData is the currency of the modern world, holding the answers to our most pressing questions. Servers collect, process, store, share, and stream this precious commodity.
Reference architectures that give you a lab-proven starting point for your next VMware, Microsoft, or open-source project.
A collection of off premise servers housed in massive data centers that can be accessed for computing or storage, the cloud has revolutionized the way we compute. Instead of a large team of IT professionals managing on-premise servers, cloud service providers offer many of the benefits but at a fraction of the cost.
Mission-critical, on-premise, and secure for when the job is so important that the system needs to be managed in house. For financial services, utilities, and federal applications; enterprise servers are powered by Micron memory and storage products.
The Goldilocks mix of on-premise and off-premise servers, a hybrid cloud approach offers flexibility to businesses with specific data storage needs. Micron products support both on- and off-premise servers, as well as the network required to orchestrate a seamless connection between the two.
The number of IoT devices is in the billions and growing. Edge gateways live close to the devices outside of the data center and help to determine which pieces of information to send ensuring only meaningful data is captured and stored.
The highest-performing computing machines in the world are powered by Micron products. Today’s HPC machines are working to solve the mysteries that have so far eluded mankind: cures for diseases, mapping the galaxy, and discovering the building blocks of atomic structures.
Artificial intelligence is changing the way that we, as humans, interact with the world. Enabling machines to sense, comprehend, act and learn, AI promises a new era of disruption with smarter and more intuitive decision making. Memory is the dynamic foundation of this revolution, transforming inputs into insights and activating data to mobilize innovation.
Memory and storage are strategic differentiators for servers and data processing, allowing us to redefine how we use information. Micron’s innovative solutions are tailored to create the most powerful server boxes possible.
DDR4 is the best mainstream generation of DRAM technology, with new features centered on power savings, performance enhancement, manufacturability, and reliability improvements. These new features improve performance, power, manufacturability, reliability and stacking capabilities for the enterprise, cloud, ultrathin, tablet, automotive and embedded markets. With data rates up to 3200 MT/s, an operating voltage of 1.2v and additional power saving features; DDR4 increases performance up to 50% while delivering total energy savings as high as 25% compared to DDR3.
Advanced Computing Solutions offer the industry’s leading technology for high-performance computing. Built on FPGA technologies and targeted at PCI Express® (PCIe®)-based HPC or stand-alone embedded applications, our modular and highly scalable architecture delivers orders-of-magnitude performance gains, reduced energy costs, small form factors and simplified application designs.
Micron's 3D NAND technology uses an innovative process architecture to provide 3X the capacity of planar NAND technologies while providing better performance and reliability.
From the ground up, we create the memory advancements and storage solutions for today’s cloud computing and data center infrastructures—enabling fast, secure, scalable, and cost-efficient systems.
WHITE PAPER
Micron’s Perspective on Impact of CXL on DRAM Bit Growth RateModern compute architectures are prone to a phenomenon known as the “memory wall” problem. CXL provides the necessary architecture to bring balance to the compute and memory scaling gap. It is the basis for creating a new vector to achieve economically viable memory solutions that will have an impact on DRAM bit growth rate.
BLOG
The ‘EPYC’ Leap into Next-Gen Data Centers: Micron’s ContributionsAMD’s next-generation server architecture has filled the news, and Micron technology was a big part of the story. Our storage and memory accelerated performance of the AMD EPYC 7002 series processor in several workloads, and the Micron 9300 high-performance SSD was chosen for media testing kits and client sample kits.
BLOG
Micron Launches Technology Enablement Program to Advance DDR5 AdoptionWhat an exciting time for DDR5! JEDEC releases revision 1.0 of the DDR5 SDRAM standards and Micron announces the Technology Enablement Program.
TECHNICAL BRIEF
AMD EPYC™ 7002 Architecture Extends Benefits for Storage-Centric SolutionsLearn how AMD EPYC™ 7002 processors provide massive storage flexibility and throughput using the latest generation of PCIe and NVMe SSDs, like the Micron 9300 and Micron 7300, for storage-centric solutions such as SDS, HCI and AI.