MT35XU512ABA1G12-0AAT

Orderable parts

MT35XU512ABA1G12-0AAT

Specs

  • Chipset Validation
    N/A
  • Density
    512Mb
  • FBGA Code
    RW303
  • Op. Temp.
    -40C to +105C
  • Part Status
    Production
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Type
    Octal I/O
  • Width
    x1/x8

Data Sheets

MT35X Micron Xccela™ Flash Memory, 512Mb, 1.8V, Octal I/O

  • File Type: PDF
  • Updated: 2018-12-21

Brief Datasheet: Xccela™ Flash Memory

This is a public, brief version of the MT35X data sheet. To request access to the full NDA version of the MT35X data sheet, please contact your sales representative.
  • File Type: PDF
  • Updated: 2018-10-02

Addendum: MT35X Automotive NOR Flash Devices

Xccela™ NOR Flash Memory
  • File Type: PDF
  • Updated: 2017-03-05

RoHS

China RoHS Certificate

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.
  • File Type: (PDF)
  • Updated: 5/1/2020

RoHS Certificate of Compliance

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.
  • File Type: (PDF)
  • Updated: 5/1/2020

Simulation Models

IBIS_MT35XU512ABAxx12-xxTT v2.1.1

x.1= 1, 2. TT= IT, AT, AUT.
  • File Type: ZIP
  • Updated: 2019-03-25

MT35X_1_8V_512Mb_x1_NoCP_Package_VG15.tar

Verilog model_Octal Serial NOR
  • File Type: GZ
  • Updated: 2019-03-25

Technical Notes

TN-00-08: Thermal Applications

This document describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2020-03-25

TN-25-08: Maximize SPI NOR, Xccela™ Flash and Quad SPI NAND Memory Design Flexibility with a Single Package

This technical note discusses how a single 24-ball BGA package (6 x 8 mm) can support a variety of flash products, enabling designers to offer a range of densities, features and performance levels simply by replacing the installed flash device.
  • File Type: PDF
  • Updated: 2018-09-17
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Customer Service Notes

CSN-07: RMA Procedures for Packaged Product and Bare Die Devices

Outlines standard returned material authorization (RMA) procedures, as well as the differences associated with bare die RMAs.
  • File Type: PDF
  • Updated: 2014-01-21

CSN-24: ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05
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