MT35XL01GBBA2G12-0SIT

Orderable parts

MT35XL01GBBA2G12-0SIT

Specs

  • Chipset Validation
    N/A
  • Density
    1Gb
  • FBGA Code
    RW268
  • Op. Temp.
    -40C to +85C
  • Part Status
    Production
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Type
    Octal I/O
  • Width
    x1/x8

Data Sheets

MT35X Micron Xccela™ Flash Memory, 1Gb, 3V, Octal I/O

MT35XL01GBBA
  • File Type: PDF
  • Updated: 2019-01-24

Brief Datasheet: Xccela™ Flash Memory

This is a public, brief version of the MT35X data sheet. To request access to the full NDA version of the MT35X data sheet, please contact your sales representative.
  • File Type: PDF
  • Updated: 2018-10-02

RoHS

China RoHS Certificate

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.
  • File Type: (PDF)
  • Updated: 9/1/2021

RoHS Certificate of Compliance

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.
  • File Type: (PDF)
  • Updated: 9/1/2021

REACH Statement

Company statement regarding REACH SVHC compliance
  • File Type: (PDF)
  • Updated: 9/1/2021

Simulation Models

IBIS_MT35XL01GBBAxx12-xxTT v2.1

x.1= 1, 2. TT= IT, AT, AUT.
  • File Type: ZIP
  • Updated: 2019-03-25

MT35X_3V_1Gb_x8_NoCP_Package_VG15.tar

Verilog model, x1 boot, w/ Testbench
  • File Type: GZ
  • Updated: 2019-03-25

Technical Notes

TN-00-08: Thermal Applications

This document describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2020-03-25

TN-25-08: Maximize SPI NOR, Xccela™ Flash and Quad SPI NAND Memory Design Flexibility with a Single Package

This technical note discusses how a single 24-ball BGA package (6 x 8 mm) can support a variety of flash products, enabling designers to offer a range of densities, features and performance levels simply by replacing the installed flash device.
  • File Type: PDF
  • Updated: 2018-09-17
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Customer Service Notes

CSN-24: ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05

CSN-18: Bare Die SiPs and MCMs

Describes design considerations for bare die SiPs and MCMs.
  • File Type: PDF
  • Updated: 2009-04-06
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