MT35XL01GBBA2G12-0AAT

Orderable parts

MT35XL01GBBA2G12-0AAT

Specs

  • Chipset Validation
    N/A
  • Density
    1Gb
  • FBGA Code
    RW310
  • Op. Temp.
    -40C to +105C
  • Part Status
    Production
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Type
    Octal I/O
  • Width
    x1/x8

Data Sheets

MT35X Micron Xccela™ Flash Memory, 1Gb, 3V, Octal I/O

MT35XL01GBBA
  • File Type: PDF
  • Updated: 2019-01-24

Brief Datasheet: Xccela™ Flash Memory

This is a public, brief version of the MT35X data sheet. To request access to the full NDA version of the MT35X data sheet, please contact your sales representative.
  • File Type: PDF
  • Updated: 2018-10-02

Addendum: MT35X 1Gb 1.8V/3V in TBGA24

Serial NOR Flash Memory: MT35XL01GBBA, MT35XU01GBBA
  • File Type: PDF
  • Updated: 2020-10-22

Addendum: MT35X Automotive NOR Flash Devices

Xccela™ NOR Flash Memory
  • File Type: PDF
  • Updated: 2017-03-05

RoHS

China RoHS Certificate

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.
  • File Type: (PDF)
  • Updated: 1/1/2022

RoHS Certificate of Compliance

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.
  • File Type: (PDF)
  • Updated: 1/1/2022

REACH Statement

Company statement regarding REACH SVHC compliance
  • File Type: (PDF)
  • Updated: 1/1/2022

Simulation Models

IBIS_MT35XL01GBBAxx12-xxTT v2.1

x.1= 1, 2. TT= IT, AT, AUT.
  • File Type: ZIP
  • Updated: 2019-03-25

MT35X_3V_1Gb_x8_NoCP_Package_VG15.tar

Verilog model, x1 boot, w/ Testbench
  • File Type: GZ
  • Updated: 2019-03-25

Technical Notes

TN-00-08: Thermal Applications

This tech note describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2021-11-16

TN-25-08: Maximize SPI NOR, Xccela™ Flash and Quad SPI NAND Memory Design Flexibility with a Single Package

This technical note discusses how a single 24-ball BGA package (6 x 8 mm) can support a variety of flash products, enabling designers to offer a range of densities, features and performance levels simply by replacing the installed flash device.
  • File Type: PDF
  • Updated: 2018-09-17
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Customer Service Notes

CSN-24: ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05

CSN-18: Bare Die SiPs and MCMs

Describes design considerations for bare die SiPs and MCMs.
  • File Type: PDF
  • Updated: 2009-04-06
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