N25Q256A13ESF40G

Orderable parts

N25Q256A13ESF40G

Specs

  • Chipset Validation
    N/A
  • Density
    256Mb
  • FBGA Code
    N/A
  • Media
    Tube
  • Op. Temp.
    -40C to +85C
  • Part Status
    Obsolete
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Type
    Multi I/O
  • Width
    x1/x2/x4

Data Sheets

N25Q 256Mb, 3V, Multiple I/O Serial Flash Memory Data Sheet

Rev X
  • File Type: PDF
  • Updated: 2018-06-13

Simulation Models

IBIS_N25Q256Ax3EPP4 v1.3

x.1= configuration. PP= 12, F8, SF.
  • File Type: ZIP
  • Updated: 2013-11-26

Technical Notes

TN-00-08: Thermal Applications

This document describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2020-03-25

TN-12-11: N25Q Serial NOR Flash Memory Software Device Drivers

This technical note provides a description of the C library source code for Micron N25Q serial NOR Flash memory devices. Download the low-level driver described in this document here.
  • File Type: PDF
  • Updated: 2013-05-08
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2020-10-13

CSN-24: ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05
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