N25Q128A

PP= 12, F7, F8, SE, SF, W7, W9, V1, V7.

Micron XIP, HOLD pin, uniform

This tech note describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.

This technical note provides a description of the C library source code for Micron N25Q serial NOR Flash memory devices. Download the low-level driver described in this document here.

Explanation of Micron packaging labels and procedures.

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.