N25Q064A11E5340F

Orderable parts

N25Q064A11E5340F

Specs

  • Chipset Validation
    N/A
  • Density
    64Mb
  • FBGA Code
    RW153
  • Media
    Tape & Reel
  • Op. Temp.
    -40C to +85C
  • Part Status
    End of Life
  • PLP
    No
  • PLP Start Date
    N/A
  • Type
    Multi I/O
  • Width
    x1/x2/x4

Data Sheets

64Mb, 1.8V, Multiple I/O Serial Flash Memory

64Mb, Multiple I/O, 4KB Subsector Erase, XiP Enabled, Serial NOR Flash Memory with 108 MHz Serial Peripheral Interface
  • File Type: PDF
  • Updated: 2018-06-13

RoHS

China RoHS Certificate

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.
  • File Type: (PDF)
  • Updated: 7/1/2019

RoHS Certificate of Compliance

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.
  • File Type: (PDF)
  • Updated: 7/1/2019

Technical Notes

TN-00-08: Thermal Applications

Describes some considerations in thermal applications for Micron memory devices
  • File Type: PDF
  • Updated: 2019-04-17

TN-25-09: Layout Guidelines - Serial NOR Flash

This technical note provides PCB designers basic guidelines for optimizing signal layout and power supply lines in Micron's Serial NOR Flash device to prevent signal integrity problems.
  • File Type: PDF
  • Updated: 2016-07-11
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2019-04-29

CSN-24: ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05
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