N25Q032A13ESE40F

Orderable parts

N25Q032A13ESE40F

Specs

  • Chipset Validation
    N/A
  • Density
    32Mb
  • FBGA Code
    N/A
  • Media
    Tape & Reel
  • Op. Temp.
    -40C to +85C
  • Part Status
    End of Life
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Type
    Multi I/O
  • Width
    x1/x2/x4

Data Sheets

32Mb, 3V, Multiple I/O Serial Flash Memory

32Mb, 3V, Multiple I/O, 4KB Subsector Erase, XiP Enabled, Serial NOR Flash Memory with 108 MHz Serial Peripheral Interface
  • File Type: PDF
  • Updated: 2018-05-31

RoHS

China RoHS Certificate

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.
  • File Type: (PDF)
  • Updated: 1/1/2020

RoHS Certificate of Compliance

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.
  • File Type: (PDF)
  • Updated: 1/1/2020

Technical Notes

TN-00-08: Thermal Applications

This document describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2020-01-10

TN-12-30: NOR Flash Cycling Endurance and Data Retention

This technical note defines the industry standards for this testing, Micron's NOR Flash testing methodology, and the two key metrics used to measure NOR device failure: cycling endurance and data retention.
  • File Type: PDF
  • Updated: 2017-11-15
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2019-04-29

CSN-07: RMA Procedures for Packaged Product and Bare Die Devices

Outlines standard returned material authorization (RMA) procedures, as well as the differences associated with bare die RMAs.
  • File Type: PDF
  • Updated: 2014-01-21
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