MT25QU128ABA1EW9-0SIT

Orderable parts

MT25QU128ABA1EW9-0SIT

Specs

  • Chipset Validation
    N/A
  • Density
    128Mb
  • FBGA Code
    RW141
  • Media
    Tray, Tape & Reel
  • Op. Temp.
    -40C to +85C
  • Part Status
    Production
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Type
    Multi I/O
  • Width
    x1/x2/x4

Data Sheets

MT25Q 128Mb, 1.8V, Multiple I/O Serial Flash Memory

The MT25QU128ABA is a high-performance multiple input/output, 128Mb, 1.8V, SPI Flash memory device.
  • File Type: PDF
  • Updated: 2019-03-06

MT25Q Devices: Multiple I/O Serial Flash Memory Electrical Addendum

DC Characteristics; VIH and VIL
  • File Type: PDF
  • Updated: 2018-09-19

RoHS

China RoHS Certificate

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.
  • File Type: (PDF)
  • Updated: 5/1/2021

RoHS Certificate of Compliance

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.
  • File Type: (PDF)
  • Updated: 5/1/2021

REACH Statement

Company statement regarding REACH SVHC compliance
  • File Type: (PDF)
  • Updated: 5/1/2021

Simulation Models

IBIS_MT25QU128ABAxxPP-xxTT v2.7

PP= 12, 14, SE, SF, W7, W9, 54. TT= IT, AT.
  • File Type: ZIP
  • Updated: 2019-03-06

MT25Q_128Mb_MicronXIP_18V_64KB_VG1.7

Verilog model MT25QU128ABA1ESE-0SIT, MT25QU128ABA1EW7-0SIT, MT25QU128ABA1EW9-0SIT, Tuning Data Pattern, 166MHz
  • File Type: GZ
  • Updated: 2019-03-20

Technical Notes

TN-00-08: Thermal Applications

This document describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2020-03-25

TN-25-09: Layout Guidelines - Serial NOR Flash

This technical note provides PCB designers basic guidelines for optimizing signal layout and power supply lines in Micron's Serial NOR Flash device to prevent signal integrity problems.
  • File Type: PDF
  • Updated: 2016-07-11
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2020-10-13

CSN-24: ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05
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