M25PX16-VMW6G

Orderable parts

M25PX16-VMW6G

Specs

  • Chipset Validation
    N/A
  • Density
    16Mb
  • FBGA Code
    N/A
  • Media
    Tube
  • Op. Temp.
    -40C to +85C
  • Part Status
    Obsolete
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Type
    Dual I/O
  • Width
    x1/x2

Data Sheets

16Mb Serial NOR Flash: M25PX16

16Mb, Dual I/O, 4KB Subsector Erase, Serial NOR Flash Memory with 75 MHz Serial Peripheral Interface
  • File Type: PDF
  • Updated: 2018-06-14

REACH Statement

Company statement regarding REACH SVHC compliance
  • File Type: (PDF)
  • Updated: 10/1/2020

Simulation Models

M25PX_IBIS, 16-VMW6, 110nm, SOP2-8/208mils (SO8W), 2.7-3.6V, v1.0

  • File Type: ZIP
  • Updated: 2012-09-06

M25PX16 75MHz VG10 Verilog

  • File Type: ZIP
  • Updated: 2008-08-27

Technical Notes

TN-00-08: Thermal Applications

This document describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2020-03-25

TN-12-30: NOR Flash Cycling Endurance and Data Retention

This technical note defines the industry standards for this testing, Micron's NOR Flash testing methodology, and the two key metrics used to measure NOR device failure: cycling endurance and data retention.
  • File Type: PDF
  • Updated: 2017-11-15
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2020-10-13

CSN-24: ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05
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