M25PX16-VMW6G

Orderable parts

M25PX16-VMW6G

Specs

  • Chipset Validation
    N/A
  • Density
    16Mb
  • FBGA Code
    N/A
  • Media
    Tube
  • Op. Temp.
    -40C to +85C
  • Part Status
    End of Life
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Type
    Dual I/O
  • Width
    x1/x2

Data Sheets

16Mb Serial NOR Flash: M25PX16

16Mb, Dual I/O, 4KB Subsector Erase, Serial NOR Flash Memory with 75 MHz Serial Peripheral Interface
  • File Type: PDF
  • Updated: 2018-06-14

RoHS

China RoHS Certificate

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.
  • File Type: (PDF)
  • Updated: 1/1/2020

RoHS Certificate of Compliance

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.
  • File Type: (PDF)
  • Updated: 1/1/2020

Simulation Models

M25PX_IBIS, 16-VMW6, 110nm, SOP2-8/208mils (SO8W), 2.7-3.6V, v1.0

  • File Type: ZIP
  • Updated: 2012-09-06

M25PX16 75MHz VG10 Verilog

  • File Type: ZIP
  • Updated: 2008-08-27

Technical Notes

TN-00-08: Thermal Applications

This document describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2020-01-10

TN-12-30: NOR Flash Cycling Endurance and Data Retention

This technical note defines the industry standards for this testing, Micron's NOR Flash testing methodology, and the two key metrics used to measure NOR device failure: cycling endurance and data retention.
  • File Type: PDF
  • Updated: 2017-11-15
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2019-04-29

CSN-07: RMA Procedures for Packaged Product and Bare Die Devices

Outlines standard returned material authorization (RMA) procedures, as well as the differences associated with bare die RMAs.
  • File Type: PDF
  • Updated: 2014-01-21
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