PC28F512M29AWLB

Orderable parts

PC28F512M29AWLB

Specs

  • Block Config
    Low Lock
  • Chipset Validation
    N/A
  • Density
    512Mb
  • FBGA Code
    N/A
  • Op. Temp.
    -40C to +85C
  • Part Family
    M29AW
  • Part Status
    Obsolete
  • PLP
    No
  • PLP Start Date
    N/A
  • Width
    x16

RoHS

China RoHS Certificate

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.
  • File Type: (PDF)
  • Updated: 5/1/2019

RoHS Certificate of Compliance

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.
  • File Type: (PDF)
  • Updated: 5/1/2019

Simulation Models

M29EW_IBIS, 512Mb, 65nm, FBGA64, 2.7-3.6V, v1.02

  • File Type: IBS
  • Updated: 2011-05-17T00:00:00.0000000Z

M29AW512 VG10 Verilog

M29AW512
  • File Type: ZIP
  • Updated: 2010-05-07T00:00:00.0000000Z

Technical Notes

TN-13-40: Migrating from Micron M29AW Devices to MT28EW NOR Flash Devices

This technical note describes the process for converting a system design for the Micron M29AW multi-level cell NOR Flash device to a system design for the Micron MT28EW single-level cell NOR Flash device, 512Mb and 1Gb densities.
  • File Type: PDF
  • Updated: 2015-01-16T06:00:00.0000000Z

TN-13-07: Patching the Linux Kernel and U-Boot for Micron M29 Flash Memory

This technical note provides a guide for modifying the memory technology device (MTD) layer software for the purpose of correctly using Micron M29 family Flash memory devices in a Linux environment. This document also describes the modifications required to make a Linux environment work with M29 Flash memory devices.
  • File Type: PDF
  • Updated: 2011-04-05T05:00:00.0000000Z

Customer Service Notes

Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2019-04-29T21:36:00.0000000Z

ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05T05:00:00.0000000Z
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