PC28F256P33BFP

Orderable parts

PC28F256P33BFP

Specs

  • Block Config
    Bottom Boot, OTP
  • Chipset Validation
    N/A
  • Density
    256Mb
  • FBGA Code
    N/A
  • Op. Temp.
    -40C to +85C
  • Part Family
    P33
  • Part Status
    Obsolete
  • PLP
    No
  • PLP Start Date
    N/A
  • Width
    x16

Data Sheets

256Mb, 512Mb (256Mb/256Mb) Parallel NOR Flash Embedded Memory (P33-65nm) data sheet

2.3V to 3.6V VCC (core) voltage, 2.3V to 3.6V VCCQ (I/O) voltage
  • File Type: PDF
  • Updated: 2018-02-09T06:00:00.0000000Z

P3x Block Locking Security Using OTP Registers

This document will explain how the standard One Time Programmable (OTP) Protection Registers may optionally be used to protect data in the Main Memory Array.
  • File Type: PDF
  • Updated: 2013-03-13T00:00:00.0000000Z

P33/P30 256M, 256M/256M Stack Specification Update

Errata
  • File Type: PDF
  • Updated: 2011-05-10T00:00:00.0000000Z

RoHS

China RoHS Certificate

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.
  • File Type: (PDF)
  • Updated: 5/1/2019

RoHS Certificate of Compliance

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.
  • File Type: (PDF)
  • Updated: 5/1/2019

Simulation Models

P33_Verilog, 256Mb, 65nm, v1.4

P33_Verilog, 256Mb, 65nm, v1.4
  • File Type: ZIP
  • Updated: 2016-05-05T00:00:00.0000000Z

Technical Notes

TN-12-06: Adapting the Linux Kernel for Micron P30, P33, and J3 Flash Memory

This technical note provides a guide for modifying the MTD device-layer software for correct use with Micron P30, P33, and J3 devices. It also describes the modifications required in the Linux environment.
  • File Type: PDF
  • Updated: 2011-10-17T05:00:00.0000000Z

TN-12-05: Password Protecting Flash Memory Blocks

This document describes a method of password protecting blocks using Micron's M29EW device, as an example.
  • File Type: PDF
  • Updated: 2011-03-11T06:00:00.0000000Z

Customer Service Notes

Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2019-04-29T21:36:00.0000000Z

ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05T05:00:00.0000000Z
+