M29W640GL70NB6F

Orderable parts

M29W640GL70NB6F

Specs

  • Block Config
    Low Lock
  • Chipset Validation
    N/A
  • Density
    64Mb
  • FBGA Code
    N/A
  • Op. Temp.
    -40C to +85C
  • Part Family
    M29W
  • Part Status
    End of Life
  • PLP
    No
  • PLP Start Date
    N/A
  • Width
    x8/x16

Data Sheets

64Mb 3V Parallel NOR Flash: M29W640GB/GH/GL/GT

64Mb (8Mb x8 or 4Mb x16), Uniform Block or Boot Block, Parallel NOR Flash Memory
  • File Type: PDF
  • Updated: 2018-02-09

RoHS

China RoHS Certificate

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.
  • File Type: (PDF)
  • Updated: 8/1/2019

RoHS Certificate of Compliance

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.
  • File Type: (PDF)
  • Updated: 8/1/2019

Simulation Models

M29W_IBIS, 640GH/GL_NB6, 110nm (T9HX), TSOP56, 2.7-3.6V, v1.0

  • File Type: ZIP
  • Updated: 2010-05-07

M29W_VHDL, 640GH/GL, 110nm, v1.0

  • File Type: ZIP
  • Updated: 2010-05-07

Technical Notes

TN-00-08: Thermal Applications

Describes some considerations in thermal applications for Micron memory devices
  • File Type: PDF
  • Updated: 2019-04-17

AN 309009: Migrating to Numonyx M29EW-S Devices from Spansion S29GLP/N-S Devices.

Application Note 309009
  • File Type: PDF
  • Updated: 2010-11-09
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2019-04-29

CSN-18: Bare Die SiPs and MCMs

Describes design considerations for bare die SiPs and MCMs.
  • File Type: PDF
  • Updated: 2009-04-06
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