M29W256GH70ZA6F

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Orderable parts

M29W256GH70ZA6F

Specs

  • Block Config
    High Lock
  • Chipset Validation
    N/A
  • Density
    256Mb
  • FBGA Code
    N/A
  • Op. Temp.
    -40C to +85C
  • Part Family
    M29W
  • Part Status
    Obsolete
  • PLP
    No
  • PLP Start Date
    N/A
  • Width
    x8/x16

Data Sheets

ERRATA - 256Mb 3V Parallel NOR Flash: M29W256GH/GL

Errata for EDP after erase on M29W256G date codes 1506 and 1512-1552
  • File Type: PDF
  • Updated: 1/15/2016
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256Mb 3V Parallel NOR Flash: M29W256GH/GL

256Mb (32Mb x8 or 16Mb x16), 3V, Page, Uniform Block, Parallel NOR Flash Memory
  • File Type: PDF
  • Updated: 2/9/2018
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RoHS

China RoHS Certificate

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.
  • File Type: (PDF)
  • Updated: 02/2019
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RoHS Certificate of Compliance

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.
  • File Type: (PDF)
  • Updated: 02/2019
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Simulation Models

M29W_Verilog, 256G, 65nm, vg12

M29W256G 256Mb
  • File Type: GZ
  • Updated: 4/17/2012
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M29W256G/M29W256GS IBIS model, 65nm, 1.65-3.6V(80ns)/2.7-3.6V(70ns), v1.2

  • File Type: ZIP
  • Updated: 2/20/2014
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Technical Notes

TN-13-14: Software Device Drivers for Micron M29W256 NOR Flash Memory

This technical note describes the library source code in C for the M29W256 Flash memory device using the Flash software device driver interface. Download the low-level driver described in this document here.
  • File Type: PDF
  • Updated: 3/8/2011
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TN-13-07: Patching the Linux Kernel and U-Boot for Micron M29 Flash Memory

This technical note provides a guide for modifying the memory technology device (MTD) layer software for the purpose of correctly using Micron M29 family Flash memory devices in a Linux environment. This document also describes the modifications required to make a Linux environment work with M29 Flash memory devices.
  • File Type: PDF
  • Updated: 4/5/2011
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Customer Service Notes

Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 10/12/2018
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ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 8/5/2010
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