3D NAND

The growing demands of mobile computing and data centers continue to drive the need for high-capacity, high-performance NAND flash technology. With planar NAND nearing its practical scaling limits, delivering to those requirements has become more difficult with each generation. Enter our 3D NAND technology, which uses an innovative process architecture to provide 3X the capacity of planar NAND technologies while providing better performance and reliability.

System designers who build products like laptops, mobile devices and servers can take advantage of 3D NAND’s unprecedented performance to meet the rising data movement needs for businesses and consumers.

Density

Select Density
  • 256Gb
  • 384Gb
  • 512Gb
  • 768Gb
  • 1Tb
  • 2Tb
  • 3Tb
  • 6Tb
Range: 256Gb - 6Tb
  • Bits/Cell
    MLC
  • Voltage
    3.3V
  • Package
    TSOP, VBGA
  • Op. Temp.
    0C to +70C
  • Bits/Cell
    TLC
  • Voltage
    3.3V
  • Package
    VBGA
  • Op. Temp.
    0C to +70C
  • Bits/Cell
    MLC
  • Voltage
    3.3V
  • Package
    TSOP
  • Op. Temp.
    0C to +70C
  • Bits/Cell
    TLC
  • Voltage
    3.3V
  • Package
    VBGA
  • Op. Temp.
    0C to +70C
  • Bits/Cell
    MLC, TLC
  • Voltage
    3.3V
  • Package
    VBGA
  • Op. Temp.
    0C to +70C
  • Bits/Cell
    MLC, TLC
  • Voltage
    3.3V
  • Package
    LBGA, VBGA
  • Op. Temp.
    0C to +70C
  • Bits/Cell
    TLC
  • Voltage
    3.3V
  • Package
    LBGA
  • Op. Temp.
    0C to +70C
  • Bits/Cell
    TLC
  • Voltage
    3.3V
  • Package
    LBGA
  • Op. Temp.
    0C to +70C
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