N2M400JDB341A3CF

Orderable parts

N2M400JDB341A3CF

Specs

  • Chipset Validation
    N/A
  • Density
    32GB
  • FBGA Code
    JW918
  • Op. Temp.
    -40C to +85C
  • Part Status
    Obsolete
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Width
    x8

REACH Statement

Company statement regarding REACH SVHC compliance
  • File Type: (PDF)
  • Updated: 8/1/2020

Simulation Models

IBIS eMMC ESG 100b IT (PS8200)

N2M400 series
  • File Type: ZIP
  • Updated: 2013-05-29

Technical Notes

TN-31-19: Adding a Delay Before LPM in UFS Mobile Platforms

This technical note recommends the addition of a delay before low-power mode in UFS platforms.
  • File Type: PDF
  • Updated: 2020-07-14

TN-00-08: Thermal Applications

This document describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2020-03-25
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2019-04-29

CSN-18: Bare Die SiPs and MCMs

Describes design considerations for bare die SiPs and MCMs.
  • File Type: PDF
  • Updated: 2009-04-06
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