N2M400GDB321A3CE

Orderable parts

N2M400GDB321A3CE

Specs

  • Chipset Validation
    N/A
  • Density
    8GB
  • FBGA Code
    JW913
  • Op. Temp.
    -40C to +85C
  • Part Status
    Obsolete
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Width
    x8

Simulation Models

IBIS eMMC ESG 100b IT (PS8200)

N2M400 series
  • File Type: ZIP
  • Updated: 2013-05-29

Technical Notes

TN-31-03: Best Practices for UFS Power Management

This technical note describes how to manage power up/off in customer systems that use Micron's Universal Flash Storage (UFS) 2.1 devices, as well as how to use the hardware reset function.
  • File Type: PDF
  • Updated: 2019-11-14

TN-29-85: UFS Memory Health Report for Mobile Devices

This technical note describes how to obtain the health report information for Micron's UFS devices.
  • File Type: PDF
  • Updated: 2019-05-10
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2019-04-29

CSN-07: RMA Procedures for Packaged Product and Bare Die Devices

Outlines standard returned material authorization (RMA) procedures, as well as the differences associated with bare die RMAs.
  • File Type: PDF
  • Updated: 2014-01-21
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