MTFC8GACAANA-4M IT

Orderable parts

MTFC8GACAANA-4M IT

Specs

  • Chipset Validation
    N/A
  • Density
    8GB
  • FBGA Code
    JWB18
  • Op. Temp.
    -40C to +85C
  • Part Status
    End of Life
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Width
    x8

Data Sheets

4GB, 8GB eMMC v4.51 80s TBGA100b IT Data Sheet

MTFC4GACAANA-4M IT, MTFC4GACAALT-4M IT, MTFC8GACAANA-4M IT, MTFC8GACAALT-4M IT
  • File Type: PDF
  • Updated: 2018-07-03

RoHS

China RoHS Certificate

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.
  • File Type: (PDF)
  • Updated: 11/1/2020

RoHS Certificate of Compliance

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.
  • File Type: (PDF)
  • Updated: 11/1/2020

REACH Statement

Company statement regarding REACH SVHC compliance
  • File Type: (PDF)
  • Updated: 11/1/2020

Simulation Models

IBIS eMMC embedded IT (PS8210 rev DC)

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  • File Type: ZIP
  • Updated: 2016-07-01

Technical Notes

TN-3115: UFS Android 10 Issue

This technical note describes an operational misalignment between a JEDEC-specified vendor-specific information register and Android 10 OS. It also describes corrective action taken by Micron to resolve the issue.
  • File Type: PDF
  • Updated: 2020-04-28

TN-00-08: Thermal Applications

This document describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2020-03-25
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2020-10-13

CSN-24: ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05
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