MTFC8GACAANA-4M IT

Orderable parts

MTFC8GACAANA-4M IT

Specs

  • Chipset Validation
    N/A
  • Density
    8GB
  • FBGA Code
    JWB18
  • Op. Temp.
    -40C to +85C
  • Part Status
    End of Life
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Width
    x8

Data Sheets

4GB, 8GB eMMC v4.51 80s TBGA100b IT Data Sheet

MTFC4GACAANA-4M IT, MTFC4GACAALT-4M IT, MTFC8GACAANA-4M IT, MTFC8GACAALT-4M IT
  • File Type: PDF
  • Updated: 2018-07-03

RoHS

China RoHS Certificate

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.
  • File Type: (PDF)
  • Updated: 9/1/2020

RoHS Certificate of Compliance

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.
  • File Type: (PDF)
  • Updated: 9/1/2020

REACH Statement

Company statement regarding REACH SVHC compliance
  • File Type: (PDF)
  • Updated: 9/1/2020

Simulation Models

IBIS eMMC embedded IT (PS8210 rev DC)

MTFC4GACAAAM-4M IT, MTFC4GACAANA-4M IT, MTFC8GACAAAM-4M IT, MTFC8GACAANA-4M IT, MTFC4GMWDM-3M AIT, MTFC4GMWDQ-3M AIT, MTFC4GMWDQ-AIT, MTFC8GLWDM-3M AIT Z, MTFC8GLWDM-AIT Z, MTFC8GLWDQ-3M AIT Z, MTFC8GLWDQ-3L AIT Z, MTFC8GLWDQ-AIT Z, MTFC16GLWDM-4M AIT Z, MTFC16GLWDQ-4M AIT Z, MTFC32GJWDQ-4M AIT Z, MTFC32GJWDQ-4L AIT Z, MTFC32GJWEF-4M AIT Z, MTFC64GJWDN-AIT Z
  • File Type: ZIP
  • Updated: 2016-07-01

Technical Notes

TN-00-08: Thermal Applications

This document describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2020-03-25

TN-2990: Managed NAND - Soft Error Rate

This technical note outlines a method of detecting and handling bit flips in a manner consistent with JEDEC specifications for operation of managed NAND devices.
  • File Type: PDF
  • Updated: 2018-01-26
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2020-09-08

CSN-37: Micron 95nm Legacy 256Mb and 512Mb DRAM Component Update

Describes certain legacy products.
  • File Type: PDF
  • Updated: 2015-01-09
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