MTFC64GAKAEYF-4M IT

Orderable parts

MTFC64GAKAEYF-4M IT

Specs

  • Chipset Validation
    N/A
  • Density
    64GB
  • FBGA Code
    JZ086
  • Op. Temp.
    -40C to +85C
  • Part Status
    End of Life
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Width
    x8

Data Sheets

eMMC v5.0 16GB, 32GB, 64GB, xFBGA153 and xBGA100, IT Data Sheet

MTFC16GAKAECN-4M IT, MTFC16GAKAEJP-4M IT, MTFC16GAKAENA-4M IT, MTFC32GAKAECN-4M IT, MTFC32GAKAEJP-4M IT, MTFC32GAKAENA-4M IT, MTFC64GAKAEEY-4M IT, MTFC64GAKAEYF-4M IT
  • File Type: PDF
  • Updated: 2018-08-14

RoHS

China RoHS Certificate

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.
  • File Type: (PDF)
  • Updated: 6/1/2021

RoHS Certificate of Compliance

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.
  • File Type: (PDF)
  • Updated: 6/1/2021

REACH Statement

Company statement regarding REACH SVHC compliance
  • File Type: (PDF)
  • Updated: 6/1/2021

Simulation Models

IBIS embedded IT eMMC 5.0 (PS8222) - v 1.12

MTFC16GAKAENA-4M IT, MTFC16GAKAECN-4M IT, MTFC16GAKAEJP-4M IT, MTFC32GAKAENA-4M IT, MTFC32GAKAECN-4M IT, MTFC32GAKAEJP-4M IT, MTFC64GAKAEEY-4M IT, MTFC64GAKAEYF-4M IT, MTFC128GAJAEDN-IT, MTFC8GACAENS-AIT, MTFC8GACAENS-K1 AIT, MTFC8GACAENS-5M AIT, MTFC8GACAEDQ-AIT, MTFC8GACAEDQ-K1 AIT, MTFC16GAKAECN-AIT, MTFC16GAKAECN-5M AIT, MTFC16GAKAEDQ-AIT, MTFC16GAKAEEF-AIT, MTFC32GAKAECN-AIT, MTFC32GAKAECN-5M AIT, MTFC32GAKAEDQ-AIT, MTFC32GAKAEEF-AIT, MTFC64GAJAEDN-AIT, MTFC64GAJAEDN-5M AIT, MTFC64GAJAEDQ-AIT, MTFC128GAJAEDN-AIT, MTFC128GAJAEDN-4M AIT, MTFC64GAJAECE-AIT, MTFC64GAJAECE-5M AIT, MTFC128GAJAECE-AIT, MTFC128GAJAECE-5M AIT, MTFC16GAKAEJP-4M IT, MTFC64GAKAEYF-4M IT, MTFC32GAKAEJP-4M IT, MTFC16GAKAEJP-AIT, MTFC16GAKAEJP-5M AIT, MTFC16GAKAEJP-AIT, MTFC16GAKAEJP-5M AIT
  • File Type: ZIP
  • Updated: 2018-02-21

Technical Notes

TN-31-18: Enabling UFS 3.1 Features in UFS 2.x Mobile Platforms

This technical note describes how to enable UFS 3.1 features in UFS 2.x mobile platforms, allowing manufacturers to quickly realize performance benefits without modifying their HW design.
  • File Type: PDF
  • Updated: 2021-01-25

TN-00-08: Thermal Applications

This document describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2020-03-25
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2020-10-13

CSN-24: ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05
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