MTFC64GAKAEYF-4M IT

Orderable parts

MTFC64GAKAEYF-4M IT

Specs

  • Chipset Validation
    N/A
  • Density
    64GB
  • FBGA Code
    JZ086
  • Op. Temp.
    -40C to +85C
  • Part Status
    Production
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Width
    x8

Data Sheets

eMMC v5.0 16GB, 32GB, 64GB, xFBGA153 and xBGA100, IT Data Sheet

MTFC16GAKAECN-4M IT, MTFC16GAKAEJP-4M IT, MTFC16GAKAENA-4M IT, MTFC32GAKAECN-4M IT, MTFC32GAKAEJP-4M IT, MTFC32GAKAENA-4M IT, MTFC64GAKAEEY-4M IT, MTFC64GAKAEYF-4M IT
  • File Type: PDF
  • Updated: 2018-08-14

RoHS

China RoHS Certificate

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.
  • File Type: (PDF)
  • Updated: 11/1/2020

RoHS Certificate of Compliance

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.
  • File Type: (PDF)
  • Updated: 11/1/2020

REACH Statement

Company statement regarding REACH SVHC compliance
  • File Type: (PDF)
  • Updated: 11/1/2020

Simulation Models

IBIS embedded IT eMMC 5.0 (PS8222) - v 1.12

MTFC16GAKAENA-4M IT, MTFC16GAKAECN-4M IT, MTFC16GAKAEJP-4M IT, MTFC32GAKAENA-4M IT, MTFC32GAKAECN-4M IT, MTFC32GAKAEJP-4M IT, MTFC64GAKAEEY-4M IT, MTFC64GAKAEYF-4M IT, MTFC128GAJAEDN-IT, MTFC8GACAENS-AIT, MTFC8GACAENS-K1 AIT, MTFC8GACAENS-5M AIT, MTFC8GACAEDQ-AIT, MTFC8GACAEDQ-K1 AIT, MTFC16GAKAECN-AIT, MTFC16GAKAECN-5M AIT, MTFC16GAKAEDQ-AIT, MTFC16GAKAEEF-AIT, MTFC32GAKAECN-AIT, MTFC32GAKAECN-5M AIT, MTFC32GAKAEDQ-AIT, MTFC32GAKAEEF-AIT, MTFC64GAJAEDN-AIT, MTFC64GAJAEDN-5M AIT, MTFC64GAJAEDQ-AIT, MTFC128GAJAEDN-AIT, MTFC128GAJAEDN-4M AIT, MTFC64GAJAECE-AIT, MTFC64GAJAECE-5M AIT, MTFC128GAJAECE-AIT, MTFC128GAJAECE-5M AIT, MTFC16GAKAEJP-4M IT, MTFC64GAKAEYF-4M IT, MTFC32GAKAEJP-4M IT, MTFC16GAKAEJP-AIT, MTFC16GAKAEJP-5M AIT, MTFC16GAKAEJP-AIT, MTFC16GAKAEJP-5M AIT
  • File Type: ZIP
  • Updated: 2018-02-21

Technical Notes

TN-3115: UFS Android 10 Issue

This technical note describes an operational misalignment between a JEDEC-specified vendor-specific information register and Android 10 OS. It also describes corrective action taken by Micron to resolve the issue.
  • File Type: PDF
  • Updated: 2020-04-28

TN-00-08: Thermal Applications

This document describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2020-03-25
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2020-10-13

CSN-24: ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05
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