MTFC4GMWDM-3M AIT A

Orderable parts

MTFC4GMWDM-3M AIT A

Specs

  • Chipset Validation
    N/A
  • Density
    4GB
  • FBGA Code
    JWD13
  • Op. Temp.
    -40C to +85C
  • Part Status
    Contact Factory
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Width
    x8

Data Sheets

4–32GB eMMC v4.51 TFBGA153 & TFBGA169 (Automotive, IT) Data Sheet

MTFC4GMWDM-3M AIT, MTFC8GLWDM-3M AIT Z, MTFC8GLWDM-AIT Z, MTFC16GLWDM-4M AIT Z, MTFC32GJWEF-4M AIT Z (Controller ID= W)
  • File Type: PDF
  • Updated: 2019-01-22

REACH Statement

Company statement regarding REACH SVHC compliance
  • File Type: (PDF)
  • Updated: 11/1/2020

Technical Notes

TN-3115: UFS Android 10 Issue

This technical note describes an operational misalignment between a JEDEC-specified vendor-specific information register and Android 10 OS. It also describes corrective action taken by Micron to resolve the issue.
  • File Type: PDF
  • Updated: 2020-04-28

TN-00-08: Thermal Applications

This document describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2020-03-25
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2020-10-13

CSN-24: ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05
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