MTFC4GMWDM-3M AIT A

Orderable parts

MTFC4GMWDM-3M AIT A

Specs

  • Chipset Validation
    N/A
  • Density
    4GB
  • FBGA Code
    JWD13
  • Op. Temp.
    -40C to +85C
  • Part Status
    Contact Factory
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Width
    x8

Data Sheets

4–32GB eMMC v4.51 TFBGA153 & TFBGA169 (Automotive, IT) Data Sheet

MTFC4GMWDM-3M AIT, MTFC8GLWDM-3M AIT Z, MTFC8GLWDM-AIT Z, MTFC16GLWDM-4M AIT Z, MTFC32GJWEF-4M AIT Z (Controller ID= W)
  • File Type: PDF
  • Updated: 2019-01-22

REACH Statement

Company statement regarding REACH SVHC compliance
  • File Type: (PDF)
  • Updated: 9/1/2020

Technical Notes

TN-00-08: Thermal Applications

This document describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2020-03-25

TN-2990: Managed NAND - Soft Error Rate

This technical note outlines a method of detecting and handling bit flips in a manner consistent with JEDEC specifications for operation of managed NAND devices.
  • File Type: PDF
  • Updated: 2018-01-26
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2020-09-08

CSN-37: Micron 95nm Legacy 256Mb and 512Mb DRAM Component Update

Describes certain legacy products.
  • File Type: PDF
  • Updated: 2015-01-09
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