MTFC32GAKAENA-4M IT

Orderable parts

MTFC32GAKAENA-4M IT

Specs

  • Chipset Validation
    N/A
  • Density
    32GB
  • FBGA Code
    JWB98
  • Op. Temp.
    -40C to +85C
  • Part Status
    End of Life
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Width
    x8

Data Sheets

eMMC v5.0 16GB, 32GB, 64GB, xFBGA153 and xBGA100, IT Data Sheet

MTFC16GAKAECN-4M IT, MTFC16GAKAEJP-4M IT, MTFC16GAKAENA-4M IT, MTFC32GAKAECN-4M IT, MTFC32GAKAEJP-4M IT, MTFC32GAKAENA-4M IT, MTFC64GAKAEEY-4M IT, MTFC64GAKAEYF-4M IT
  • File Type: PDF
  • Updated: 2018-08-14

RoHS

China RoHS Certificate

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.
  • File Type: (PDF)
  • Updated: 9/1/2019

RoHS Certificate of Compliance

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.
  • File Type: (PDF)
  • Updated: 9/1/2019

Technical Notes

TN-29-85: UFS Memory Health Report for Mobile Devices

This technical note describes how to obtain the health report information for Micron's UFS devices.
  • File Type: PDF
  • Updated: 2019-05-10

TN-2990: Managed NAND - Soft Error Rate

This technical note outlines a method of detecting and handling bit flips in a manner consistent with JEDEC specifications for operation of managed NAND devices.
  • File Type: PDF
  • Updated: 2018-01-26
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2019-04-29

CSN-18: Bare Die SiPs and MCMs

Describes design considerations for bare die SiPs and MCMs.
  • File Type: PDF
  • Updated: 2009-04-06
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