MTFC2GMDEA-0M WT

Orderable parts

MTFC2GMDEA-0M WT

Specs

  • Chipset Validation
    N/A
  • Density
    2GB
  • FBGA Code
    JW999
  • Op. Temp.
    -25C to +85C
  • Part Status
    Production
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Width
    x8

Data Sheets

e·MMC v4.41: 2GB, 4GB, 8GB, 16GB, 32GB, 64GB, –25˚C to +85˚C, 153b/169b

MTFC2GMDEA-0M WT, MTFC2GMDEA-0M WT A, MTFC4GLDEA-0M WT, MTFC4GMDEA-1M WT, MTFC8GLDEA-1M WT, MTFC16GJDEC-2M WT, MTFC32GJDED-3M WT, MTFC64GJDDN-3M WT
  • File Type: PDF
  • Updated: 2019-04-01

RoHS

China RoHS Certificate

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.
  • File Type: (PDF)
  • Updated: 11/1/2019

RoHS Certificate of Compliance

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.
  • File Type: (PDF)
  • Updated: 11/1/2019

Simulation Models

IBIS eMMC ESG WT (PS8200)

MTFC2GMTEA-0F WT, MTFC2GMVEA-L1 WT, MTFC2GMVEA-0M WT, MTFC2GMDEA-0M WT, MTFC4GLTEA-0F WT, MTFC4GLVEA-0M WT, MTFC4GLDEA-0M WT, MTFC4GMTEA-1F WT, MTFC4GMVEA-1M WT, MTFC4GMDEA-1M WT, MTFC8GLTEA-1F WT, MTFC8GLVEA-1M WT, MTFC8GLDEA-1M WT, MTFC16GLUAM-1M WT, MTFC16GJTEC-2F WT, MTFC16GJVEC-2M WT,MTFC16GJDEC-2M WT, MTFC16GJDEC-H1 WT, MTFC32GJTED-3F WT, MTFC32GJVED-3M WT, MTFC32GJDED-3M WT, MTFC64GJTDN-3F WT, MTFC64GJVDN-3M WT, MTFC64GJDDN-3M WT
  • File Type: ZIP
  • Updated: 2015-05-04

Technical Notes

TN-29-85: UFS Memory Health Report for Mobile Devices

This technical note describes how to obtain the health report information for Micron's UFS devices.
  • File Type: PDF
  • Updated: 2019-05-10

TN-2990: Managed NAND - Soft Error Rate

This technical note outlines a method of detecting and handling bit flips in a manner consistent with JEDEC specifications for operation of managed NAND devices.
  • File Type: PDF
  • Updated: 2018-01-26
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2019-04-29

CSN-07: RMA Procedures for Packaged Product and Bare Die Devices

Outlines standard returned material authorization (RMA) procedures, as well as the differences associated with bare die RMAs.
  • File Type: PDF
  • Updated: 2014-01-21
See All
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