MTFC16GJVEC-2M WT

Orderable parts

MTFC16GJVEC-2M WT

Specs

  • Chipset Validation
    N/A
  • Density
    16GB
  • FBGA Code
    JW852
  • Op. Temp.
    -25C to +85C
  • Part Status
    Obsolete
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Width
    x8

REACH Statement

Company statement regarding REACH SVHC compliance
  • File Type: (PDF)
  • Updated: 12/1/2020

Simulation Models

IBIS eMMC ESG WT (PS8200)

MTFC2GMTEA-0F WT, MTFC2GMVEA-L1 WT, MTFC2GMVEA-0M WT, MTFC2GMDEA-0M WT, MTFC4GLTEA-0F WT, MTFC4GLVEA-0M WT, MTFC4GLDEA-0M WT, MTFC4GMTEA-1F WT, MTFC4GMVEA-1M WT, MTFC4GMDEA-1M WT, MTFC8GLTEA-1F WT, MTFC8GLVEA-1M WT, MTFC8GLDEA-1M WT, MTFC16GLUAM-1M WT, MTFC16GJTEC-2F WT, MTFC16GJVEC-2M WT,MTFC16GJDEC-2M WT, MTFC16GJDEC-H1 WT, MTFC32GJTED-3F WT, MTFC32GJVED-3M WT, MTFC32GJDED-3M WT, MTFC64GJTDN-3F WT, MTFC64GJVDN-3M WT, MTFC64GJDDN-3M WT
  • File Type: ZIP
  • Updated: 2015-05-04

Technical Notes

TN-3115: UFS Android 10 Issue

This technical note describes an operational misalignment between a JEDEC-specified vendor-specific information register and Android 10 OS. It also describes corrective action taken by Micron to resolve the issue.
  • File Type: PDF
  • Updated: 2020-04-28

TN-00-08: Thermal Applications

This document describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2020-03-25
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2020-10-13

CSN-24: ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05
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