MTFC16GJDDQ-4M IT

Orderable parts

MTFC16GJDDQ-4M IT

Specs

  • Chipset Validation
    N/A
  • Density
    16GB
  • FBGA Code
    JWA14
  • Op. Temp.
    -40C to +85C
  • Part Status
    Obsolete
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Width
    x8

Technical Notes

TN-29-85: UFS Memory Health Report for Mobile Devices

This technical note describes how to obtain the health report information for Micron's UFS devices.
  • File Type: PDF
  • Updated: 2019-05-10

TN-2990: Managed NAND - Soft Error Rate

This technical note outlines a method of detecting and handling bit flips in a manner consistent with JEDEC specifications for operation of managed NAND devices.
  • File Type: PDF
  • Updated: 2018-01-26
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2019-04-29

CSN-07: RMA Procedures for Packaged Product and Bare Die Devices

Outlines standard returned material authorization (RMA) procedures, as well as the differences associated with bare die RMAs.
  • File Type: PDF
  • Updated: 2014-01-21
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