MT48LC4M32B2B5-6A

Orderable parts

MT48LC4M32B2B5-6A:L

Specs

  • Chipset Validation
    N/A
  • Data Rate
    PC133
  • Density
    128Mb
  • FBGA Code
    D9NQR
  • Op. Temp.
    0C to +70C
  • Part Status
    Production
  • PLP
    No
  • PLP Start Date
    N/A
  • Width
    x32

Data Sheets

128Mb: x32 SDRAM

  • File Type: PDF
  • Updated: 4/6/2016

RoHS

China RoHS Certificate

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.
  • File Type: (PDF)
  • Updated: 12/2018

RoHS Certificate of Compliance

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.
  • File Type: (PDF)
  • Updated: 12/2018

SIM Models

HSpice

2.0 (Die Rev. L)
  • File Type: ZIP
  • Updated: 8/26/2011

IBIS

2.0 (Die Rev. L)
  • File Type: ZIP
  • Updated: 8/26/2011

Technical Notes

TN-00-08: Thermal Applications

Describes some considerations in thermal applications for Micron memory devices
  • File Type: PDF
  • Updated: 2/15/2018

TN-00-19: Thinning Considerations for Wafer Products

This technical note provides information on optimal wafer-thinning processes to meet specific customer requirements.
  • File Type: PDF
  • Updated: 10/15/2009

Customer Service Notes

Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 10/12/2018

ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 8/5/2010
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