MT48LC32M8A2TG-75 L

Orderable parts

MT48LC32M8A2TG-75 L:D

Specs

  • Chipset Validation
    N/A
  • Data Rate
    PC133
  • Density
    256Mb
  • FBGA Code
    N/A
  • Op. Temp.
    0C to +70C
  • Part Status
    Obsolete
  • PLP
    No
  • PLP Start Date
    N/A
  • Width
    x8

Data Sheets

256Mb: x4, x8, x16 SDRAM

  • File Type: PDF
  • Updated: 5/20/2015

RoHS

China RoHS Certificate

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.
  • File Type: (PDF)
  • Updated: 12/2018

SIM Models

Verilog

  • File Type: ZIP
  • Updated: 3/21/2001

HSpice

2.1 (Die Rev. D)
  • File Type: ZIP
  • Updated: 6/9/2006

IBIS

2.3 (Die Rev. D)
  • File Type: ZIP
  • Updated: 6/9/2006

Technical Notes

TN-00-08: Thermal Applications

Describes some considerations in thermal applications for Micron memory devices
  • File Type: PDF
  • Updated: 2/15/2018

TN-00-19: Thinning Considerations for Wafer Products

This technical note provides information on optimal wafer-thinning processes to meet specific customer requirements.
  • File Type: PDF
  • Updated: 10/15/2009

Customer Service Notes

Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 10/12/2018

ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 8/5/2010
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