MT48LC32M8A2P-6A

Orderable parts

MT48LC32M8A2P-6A:D
MT48LC32M8A2P-6A:G

Specs

  • Chipset Validation
    N/A
  • Data Rate
    PC133
  • Density
    256Mb
  • FBGA Code
    N/A
  • Op. Temp.
    0C to +70C
  • Part Status
    Production
  • PLP
    No
  • PLP Start Date
    N/A
  • Width
    x8
  • Chipset Validation
    N/A
  • Data Rate
    PC133
  • Density
    256Mb
  • FBGA Code
    D9NNT
  • Op. Temp.
    0C to +70C
  • Part Status
    Production
  • PLP
    No
  • PLP Start Date
    N/A
  • Width
    x8

Data Sheets

256Mb: x4, x8, x16 SDRAM

  • File Type: PDF
  • Updated: 2015-05-20

RoHS

China RoHS Certificate

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.
  • File Type: (PDF)
  • Updated: 8/1/2019

RoHS Certificate of Compliance

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.
  • File Type: (PDF)
  • Updated: 8/1/2019

Simulation Models

HSpice

2.0 (Die Rev. G)
  • File Type: ZIP
  • Updated: 2011-07-21

HSpice

2.1 (Die Rev. D)
  • File Type: ZIP
  • Updated: 2006-06-09

IBIS

2.0 (Die Rev. G)
  • File Type: ZIP
  • Updated: 2011-07-21

IBIS

2.3 (Die Rev. D)
  • File Type: ZIP
  • Updated: 2006-06-09

64Mb - 512Mb SDRAM Verilog Model

Revision 2.3
  • File Type: ZIP
  • Updated: 2016-05-12

Technical Notes

TN-00-08: Thermal Applications

Describes some considerations in thermal applications for Micron memory devices
  • File Type: PDF
  • Updated: 2019-04-17

LVTTL Derating for SDRAM Slew Rate Violations

Describes the proper setup and hold time derating when the slew rate during transition time violates specification.
  • File Type: PDF
  • Updated: 2009-11-19
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2019-04-29

CSN-18: Bare Die SiPs and MCMs

Describes design considerations for bare die SiPs and MCMs.
  • File Type: PDF
  • Updated: 2009-04-06
See All
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