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MT48LC32M8A2BB-75

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Orderable parts

MT48LC32M8A2BB-75:D

Specs

  • Chipset Validation
    N/A
  • Data Rate
    PC133
  • Density
    256Mb
  • FBGA Code
    D9FDL
  • Op. Temp.
    0C to +70C
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Width
    x8

Technical Notes

TN-00-08: Thermal Applications

This tech note describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2022-08-09
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LVTTL Derating for SDRAM Slew Rate Violations

Describes the proper setup and hold time derating when the slew rate during transition time violates specification.
  • File Type: PDF
  • Updated: 2009-11-19
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TN-00-19: Thinning Considerations for Wafer Products

This technical note provides information on optimal wafer-thinning processes to meet specific customer requirements.
  • File Type: PDF
  • Updated: 2009-10-15
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2021-12-06
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CSN-18: Bare Die SiPs and MCMs

Describes design considerations for bare die SiPs and MCMs.
  • File Type: PDF
  • Updated: 2009-04-06
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