MT48LC16M16A2F4-6A

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Orderable parts

Specs

Data Sheets

256Mb: x4, x8, x16 SDRAM

File Type: PDF
Updated: 2015-05-20

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Simulation Models

64Mb - 512Mb SDRAM Verilog Model

Revision 2.3

File Type: ZIP
Updated: 2016-05-12

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Technical Notes

TN-00-08: Thermal Applications

This tech note describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.

File Type: PDF
Updated: 2022-08-09

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LVTTL Derating for SDRAM Slew Rate Violations

Describes the proper setup and hold time derating when the slew rate during transition time violates specification.

File Type: PDF
Updated: 2009-11-19

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TN-00-19: Thinning Considerations for Wafer Products

This technical note provides information on optimal wafer-thinning processes to meet specific customer requirements.

File Type: PDF
Updated: 2009-10-15

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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.

File Type: PDF
Updated: 2021-12-06

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CSN-18: Bare Die SiPs and MCMs

Describes design considerations for bare die SiPs and MCMs.

File Type: PDF
Updated: 2009-04-06

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