MT49H8M36BM-5 IT

Orderable parts

MT49H8M36BM-5 IT

Specs

  • Chipset Validation
    N/A
  • Density
    288Mb
  • FBGA Code
    D9GGL
  • Op. Temp.
    -40C to +95C
  • Part Status
    Obsolete
  • PLP
    No
  • PLP Start Date
    N/A
  • Technology
    RLDRAM 2
  • Width
    x36

Data Sheets

288Mb: x36, x18, x9 2.5V VEXT, 1.8V VDD, HSTL, RLDRAM 2

  • File Type: PDF
  • Updated: 2015-10-09T05:00:00.0000000Z

RoHS

China RoHS Certificate

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.
  • File Type: (PDF)
  • Updated: 4/1/2019

RoHS Certificate of Compliance

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.
  • File Type: (PDF)
  • Updated: 4/1/2019

Simulation Models

Verilog

3.12
  • File Type: ZIP
  • Updated: 2009-12-17T00:00:00.0000000Z

Technical Notes

TN-00-08: Thermal Applications

Describes some considerations in thermal applications for Micron memory devices
  • File Type: PDF
  • Updated: 2018-02-15T06:00:00.0000000Z

TN-44-01: RLDRAM 3 Design Guide

Contains practical recommendations for developing high-performance memory subsystems while ensuring stability for long-term reliable operation of the devices.
  • File Type: PDF
  • Updated: 2011-08-26T05:00:00.0000000Z

Customer Service Notes

Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2018-10-12T05:00:00.0000000Z

ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05T05:00:00.0000000Z
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