MT49H8M36BM-25

Orderable parts

MT49H8M36BM-25
MT49H8M36BM-25:B

Specs

  • Chipset Validation
    N/A
  • Density
    288Mb
  • FBGA Code
    D9FKV
  • Op. Temp.
    0C to +95C
  • Part Status
    Obsolete
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Technology
    RLDRAM 2
  • Width
    x36
  • Chipset Validation
    N/A
  • Density
    288Mb
  • FBGA Code
    D9NCR
  • Op. Temp.
    0C to +95C
  • Part Status
    Obsolete
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Technology
    RLDRAM 2
  • Width
    x36

Data Sheets

288Mb: x36, x18, x9 2.5V VEXT, 1.8V VDD, HSTL, RLDRAM 2

  • File Type: PDF
  • Updated: 2015-10-09

Simulation Models

HSpice

REV 2.1. Die Rev B
  • File Type: ZIP
  • Updated: 2011-07-27

BSDL Rev 1.0 (Die Rev B)

  • File Type: TXT
  • Updated: 2011-09-22

IBIS

REV 2.5 (Die Rev B)
  • File Type: ZIP
  • Updated: 2015-08-12

Verilog

3.12
  • File Type: ZIP
  • Updated: 2009-12-17

Technical Notes

TN-00-08: Thermal Applications

Describes some considerations in thermal applications for Micron memory devices
  • File Type: PDF
  • Updated: 2019-04-17

TN-44-01: RLDRAM 3 Design Guide

Contains practical recommendations for developing high-performance memory subsystems while ensuring stability for long-term reliable operation of the devices.
  • File Type: PDF
  • Updated: 2011-08-26
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2019-04-29

CSN-18: Bare Die SiPs and MCMs

Describes design considerations for bare die SiPs and MCMs.
  • File Type: PDF
  • Updated: 2009-04-06
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