MT49H16M36SJ-18 IT

Orderable parts

MT49H16M36SJ-18 IT:B

Specs

  • Chipset Validation
    N/A
  • Density
    576Mb
  • FBGA Code
    D9TML
  • Op. Temp.
    -40C to +95C
  • Part Status
    Production
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Technology
    RLDRAM 2
  • Width
    x36

Data Sheets

576Mb: x9 x18 x36 CIO RLDRAM 2

  • File Type: PDF
  • Updated: 2015-09-14

RoHS

China RoHS Certificate

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.
  • File Type: (PDF)
  • Updated: 4/1/2020

RoHS Certificate of Compliance

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.
  • File Type: (PDF)
  • Updated: 4/1/2020

Simulation Models

IBIS

REV 2.5 (Die Rev B)
  • File Type: ZIP
  • Updated: 2015-08-12

HSpice

REV 2.1 (Die Rev B)
  • File Type: ZIP
  • Updated: 2011-07-27

Technical Notes

TN-00-08: Thermal Applications

This document describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2020-03-25

TN-49-03: RLDRAM 2 Clocking Strategies

This technical note addresses the operation of the RLDRAM 2 device outside the specified range of clock periods and the timing changes that occur in this mode of operation.
  • File Type: PDF
  • Updated: 2012-10-04
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2019-04-29

CSN-30: Lead Frame Package User Guidelines

Discusses Micron's lead-frame package options
  • File Type: PDF
  • Updated: 2011-05-27
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