MT49H16M18CBM-25 IT

Orderable parts

MT49H16M18CBM-25 IT:B

Specs

  • Chipset Validation
    N/A
  • Density
    288Mb
  • FBGA Code
    D9NCK
  • Op. Temp.
    -40C to +95C
  • Part Status
    Obsolete
  • PLP
    No
  • PLP Start Date
    N/A
  • Technology
    RLDRAM 2
  • Width
    x18

Data Sheets

288Mb: x18, 2.5V VEXT, 1.8V VDD, HSTL, SIO, RLDRAM 2

  • File Type: PDF
  • Updated: 10/9/2015

RoHS

China RoHS Certificate

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.
  • File Type: (PDF)
  • Updated: 12/2018

RoHS Certificate of Compliance

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.
  • File Type: (PDF)
  • Updated: 12/2018

SIM Models

BSDL

REV 1.0 (Die Rev B)
  • File Type: ZIP
  • Updated: 6/23/2011

HSpice

REV 2.1. Die Rev B
  • File Type: ZIP
  • Updated: 7/27/2011

IBIS

REV 2.5 (Die Rev B)
  • File Type: ZIP
  • Updated: 8/12/2015

Technical Notes

TN-00-08: Thermal Applications

Describes some considerations in thermal applications for Micron memory devices
  • File Type: PDF
  • Updated: 2/15/2018

TN-44-01: RLDRAM 3 Design Guide

Contains practical recommendations for developing high-performance memory subsystems while ensuring stability for long-term reliable operation of the devices.
  • File Type: PDF
  • Updated: 8/26/2011

Customer Service Notes

Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 10/12/2018

ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 8/5/2010
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