MT49H16M18CBM-25

Orderable parts

MT49H16M18CBM-25
MT49H16M18CBM-25:B

Specs

  • Chipset Validation
    N/A
  • Density
    288Mb
  • FBGA Code
    D9GFM
  • Op. Temp.
    0C to +95C
  • Part Status
    End of Life
  • PLP
    No
  • PLP Start Date
    N/A
  • Technology
    RLDRAM 2
  • Width
    x18
  • Chipset Validation
    N/A
  • Density
    288Mb
  • FBGA Code
    D9NCJ
  • Op. Temp.
    0C to +95C
  • Part Status
    End of Life
  • PLP
    No
  • PLP Start Date
    N/A
  • Technology
    RLDRAM 2
  • Width
    x18

Data Sheets

288Mb: x18, 2.5V VEXT, 1.8V VDD, HSTL, SIO, RLDRAM 2

  • File Type: PDF
  • Updated: 2015-10-09T05:00:00.0000000Z

RoHS

China RoHS Certificate

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.
  • File Type: (PDF)
  • Updated: 6/1/2019

RoHS Certificate of Compliance

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.
  • File Type: (PDF)
  • Updated: 6/1/2019

Simulation Models

HSpice

REV 2.1. Die Rev B
  • File Type: ZIP
  • Updated: 2011-07-27T05:00:00.0000000Z

BSDL

REV 1.0 (Die Rev B)
  • File Type: ZIP
  • Updated: 2011-06-23T00:00:00.0000000Z

IBIS

REV 2.5 (Die Rev B)
  • File Type: ZIP
  • Updated: 2015-08-12T05:00:00.0000000Z

Verilog

3.12
  • File Type: ZIP
  • Updated: 2009-12-17T00:00:00.0000000Z

Verilog

3.1
  • File Type: ZIP
  • Updated: 2009-05-20T00:00:00.0000000Z

Technical Notes

TN-00-08: Thermal Applications

Describes some considerations in thermal applications for Micron memory devices
  • File Type: PDF
  • Updated: 2019-04-17T15:39:00.0000000Z

TN-44-01: RLDRAM 3 Design Guide

Contains practical recommendations for developing high-performance memory subsystems while ensuring stability for long-term reliable operation of the devices.
  • File Type: PDF
  • Updated: 2011-08-26T05:00:00.0000000Z

Customer Service Notes

Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2019-04-29T21:36:00.0000000Z

ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05T05:00:00.0000000Z
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