MT49H16M18BM-25

Orderable parts

MT49H16M18BM-25
MT49H16M18BM-25:B

Specs

  • Chipset Validation
    N/A
  • Density
    288Mb
  • FBGA Code
    D9FXG
  • Op. Temp.
    0C to +95C
  • Part Status
    Obsolete
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Technology
    RLDRAM 2
  • Width
    x18
  • Chipset Validation
    N/A
  • Density
    288Mb
  • FBGA Code
    D9NCC
  • Op. Temp.
    0C to +95C
  • Part Status
    Obsolete
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Technology
    RLDRAM 2
  • Width
    x18

Data Sheets

288Mb: x36, x18, x9 2.5V VEXT, 1.8V VDD, HSTL, RLDRAM 2

  • File Type: PDF
  • Updated: 2015-10-09

Simulation Models

HSpice

REV 2.1. Die Rev B
  • File Type: ZIP
  • Updated: 2011-07-27

BSDL

REV 1.0 (Die Rev B)
  • File Type: ZIP
  • Updated: 2011-06-23

IBIS

REV 2.5 (Die Rev B)
  • File Type: ZIP
  • Updated: 2015-08-12

Verilog

3.12
  • File Type: ZIP
  • Updated: 2009-12-17

Technical Notes

TN-00-08: Thermal Applications

This tech note describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2022-08-09

TN-44-01: RLDRAM 3 Design Guide

Contains practical recommendations for developing high-performance memory subsystems while ensuring stability for long-term reliable operation of the devices.
  • File Type: PDF
  • Updated: 2011-08-26
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2021-12-06

CSN-24: ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05
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