MT44K32M18RB-093E

Orderable parts

Specs

Technical Notes

TN-00-08: Thermal Applications

This document describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2020-01-10

TN-49-03: RLDRAM 2 Clocking Strategies

This technical note addresses the operation of the RLDRAM 2 device outside the specified range of clock periods and the timing changes that occur in this mode of operation.
  • File Type: PDF
  • Updated: 2012-10-04
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2019-04-29

CSN-30: Lead Frame Package User Guidelines

Discusses Micron's lead-frame package options
  • File Type: PDF
  • Updated: 2011-05-27
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