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MT62F1536M64D8CH-031 WT

Orderable parts

MT62F1536M64D8CH-031 WT:A

Specs

  • Ball Count
    496-ball
  • Chipset Validation
    N/A
  • Cycle Time
  • Density
    32Gb
  • FBGA Code
    D9ZMM
  • Op. Temp.
    -25C to +85C
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Technology
    LPDDR5
  • Width
    x64

REACH Statement

REACH Statement

Company statement regarding REACH SVHC compliance
  • File Type: (PDF)
  • Updated: 2/1/2024

Technical Notes

TN-00-08: Thermal Applications

This tech note describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2022-08-09

TN-42-02: LPDDR2 Dual Die Package to Single Die Package Migration

This technical note provides information to enable migration of a Micron 1Gb LPDDR2 product from a dual-die package to a single-die package.
  • File Type: PDF
  • Updated: 2014-12-18

TN-46-12: Mobile DRAM Power-Saving Features and Calculations

This technical note addresses the power-saving features and power calculations of low-power Mobile LPDRAM memory.
  • File Type: PDF
  • Updated: 2009-05-16
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2021-12-06

CSN-24: ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05
See All
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