MT62F1536M64D8CH-031 WT

Orderable parts

MT62F1536M64D8CH-031 WT:A

Specs

  • Chipset Validation
    N/A
  • Cycle Time
    6400 MB/s
  • Data Rate
    6400Mbps
  • Density
    96Gb
  • FBGA Code
    D9ZMM
  • Op. Temp.
    -25C to +85C
  • Part Status
    Production
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Technology
    LPDDR5
  • Width
    x64

REACH Statement

Company statement regarding REACH SVHC compliance
  • File Type: (PDF)
  • Updated: 5/1/2022

Simulation Models

HSPICE: 12Gb Mobile LPDDR5 Y2BM

WT, AT, IT, UT, Y2BM Mobile LPDDR5 SDRAM, Die Rev. A, 496b 8DP(12GB), 496b QDP(6GB), 441b QDP(6GB), 436b 8DP(12GB), 315b 8DP(12GB), 315b QDP(6GB), 315b DDP(3GB)
  • File Type: ZIP
  • Updated: 2020-10-27

IBIS: 12Gb Mobile LPDDR5 Y2BM

WT, AT, IT, UT, Y2BM Mobile LPDDR5 SDRAM, Die Rev. A, 496b 8DP(12GB), 496b QDP(6GB), 441b QDP(6GB), 436b 8DP(12GB), 315b 8DP(12GB), 315b QDP(6GB), 315b DDP(3GB)
  • File Type: ZIP
  • Updated: 2020-10-27

S-parameter: Mobile LPDDR5 Y2BM 496b 8DP 12GB

496b 12GB LPDDR5 SDRAM (12Gb Mobile LPDDR5 Y2BM 8pcs)
  • File Type: ZIP
  • Updated: 2020-10-27

Technical Notes

TN-00-08: Thermal Applications

This tech note describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2021-11-16

TN-00-19: Thinning Considerations for Wafer Products

This technical note provides information on optimal wafer-thinning processes to meet specific customer requirements.
  • File Type: PDF
  • Updated: 2009-10-15
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2021-12-06

CSN-24: ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05
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