MT53E768M32D4DT-053 AAT

Orderable parts

MT53E768M32D4DT-053 AAT:E

Specs

  • Chipset Validation
    N/A
  • Cycle Time
  • Data Rate
    DDR4-3732
  • Density
    24Gb
  • FBGA Code
    D9WRV
  • Op. Temp.
    -40C to +105C
  • Part Status
    Production
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Technology
    LPDDR4
  • Width
    x32

Data Sheets

Production Data Sheet: 200b: x32 Automotive LPDDR4/LPDDR4X SDRAM (Z1AM)

MT53E384M32D2, MT53E768M32D4
  • File Type: PDF
  • Updated: 2020-04-01

RoHS

China RoHS Certificate

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.
  • File Type: (PDF)
  • Updated: 10/1/2020

RoHS Certificate of Compliance

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.
  • File Type: (PDF)
  • Updated: 10/1/2020

REACH Statement

Company statement regarding REACH SVHC compliance
  • File Type: (PDF)
  • Updated: 10/1/2020

Simulation Models

HSPICE: 6Gb Mobile LPDDR4 Z1AM

6Gb Mobile LPDDR4, Die Rev. E, WT, XT, UT, AT, IT, 200b, 366b, 376b, 556b
  • File Type: ZIP
  • Updated: 2020-06-10

IBIS: 6Gb Mobile LPDDR4 Z1AM

WT, XT, UT, AT, IT, Z1AM Mobile LPDDR4 SDRAM, Die Rev. E, 200b, 366b, 376b, 556b
  • File Type: ZIP
  • Updated: 2020-06-10

Technical Notes

TN-00-15: Recommended Soldering Parameters

Defines the recommended soldering techniques and parameters for Micron Technology, Inc., products.
  • File Type: PDF
  • Updated: 2020-04-02

TN-00-08: Thermal Applications

This document describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2020-03-25
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2020-10-13

CSN-24: ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05
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