MT53E512M32D2FW-046 AAT

Orderable parts

MT53E512M32D2FW-046 AAT:D

Specs

  • Chipset Validation
    N/A
  • Cycle Time
  • Data Rate
  • Density
    16Gb
  • FBGA Code
    D9ZZG
  • Op. Temp.
    -40C to +105C
  • Part Status
    Sampling
  • Product Longevity Program
    Yes
  • Product Longevity Program Start Date
    7/1/2020
  • Technology
    LPDDR4
  • Width
    x32

Data Sheets

Production Data Sheet: 200b: x16/x32 Automotive LPDDR4/LPDDR4X SDRAM (Z11M)

MT53E512M16D1, MT53E512M32D2
  • File Type: PDF
  • Updated: 2021-02-03

Technical Notes

TN-00-08: Thermal Applications

This tech note describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2022-08-09

TN-00-14: Understanding Quality and Reliability Requirements for Bare Die Applications

This technical note describes the quality and reliability requirements for bare die applications.
  • File Type: PDF
  • Updated: 2009-10-15
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2021-12-06

CSN-24: ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05
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