MT53E384M32D2DS-046 AIT

Orderable parts

MT53E384M32D2DS-046 AIT:E

Specs

  • Chipset Validation
    N/A
  • Cycle Time
  • Data Rate
    DDR4-4166
  • Density
    12Gb
  • FBGA Code
    D9WRF
  • Op. Temp.
  • Part Status
    Production
  • PLP
    No
  • PLP Start Date
    N/A
  • Technology
    LPDDR4
  • Width
    x32

RoHS

China RoHS Certificate

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.
  • File Type: (PDF)
  • Updated: 6/1/2019

RoHS Certificate of Compliance

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.
  • File Type: (PDF)
  • Updated: 6/1/2019

Simulation Models

HSPICE: 6Gb Mobile LPDDR4 Z1AM

6Gb Mobile LPDDR4, Die Rev. E, WT, XT, UT, AT, IT, 200b, 366b
  • File Type: ZIP
  • Updated: 2019-05-08T04:45:00.0000000Z

IBIS: 6Gb Mobile LPDDR4 Z1AM

WT, XT, UT, AT, IT, Z1AM Mobile LPDDR4 SDRAM, Die Rev. E, 200b, 366b, 376b, 556b
  • File Type: ZIP
  • Updated: 2019-05-08T04:45:00.0000000Z

Technical Notes

TN-00-08: Thermal Applications

Describes some considerations in thermal applications for Micron memory devices
  • File Type: PDF
  • Updated: 2019-04-17T15:39:00.0000000Z

Bypass Capacitor Selection for High-Speed Designs

Describes bypass capacitor selection for high-speed designs.
  • File Type: PDF
  • Updated: 2011-03-23T05:00:00.0000000Z

Customer Service Notes

Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2019-04-29T21:36:00.0000000Z

ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05T05:00:00.0000000Z
+