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MT53E256M32D2DS-046 WT

Orderable parts

MT53E256M32D2DS-046 WT:B

Specs

  • Ball Count
  • Chipset Validation
    N/A
  • Cycle Time
  • Density
    8Gb
  • FBGA Code
    D9ZFG
  • Op. Temp.
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Technology
    LPDDR4
  • Width
    x32

Data Sheets

Data Sheet: 200b, x16/x32, Embedded LPDDR4/LPDDR4X SDRAM (Z00M)

MT53E256M16D1, MT53E256M32D2
  • File Type: PDF
  • Updated: 2021-02-23

REACH Statement

REACH Statement

Company statement regarding REACH SVHC compliance
  • File Type: (PDF)
  • Updated: 2/1/2024

Technical Notes

TN-00-08: Thermal Applications

This tech note describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2022-08-09

TN-42-02: LPDDR2 Dual Die Package to Single Die Package Migration

This technical note provides information to enable migration of a Micron 1Gb LPDDR2 product from a dual-die package to a single-die package.
  • File Type: PDF
  • Updated: 2014-12-18

TN-46-12: Mobile DRAM Power-Saving Features and Calculations

This technical note addresses the power-saving features and power calculations of low-power Mobile LPDRAM memory.
  • File Type: PDF
  • Updated: 2009-05-16
See All

Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2021-12-06

CSN-24: ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05
See All
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