MT53E256M32D2DS-046 AIT

Orderable parts

MT53E256M32D2DS-046 AIT:B

Specs

  • Chipset Validation
    N/A
  • Cycle Time
  • Data Rate
    DDR4-4166
  • Density
    8Gb
  • FBGA Code
    D9WQS
  • Op. Temp.
    -40C to +95C
  • Part Status
    Production
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Technology
    LPDDR4
  • Width
    x32

Data Sheets

Data Sheet: 200b: x32 Automotive LPDDR4/LPDDR4X SDRAM (Z00M)

MT53E256M16D1, MT53E256M32D2
  • File Type: PDF
  • Updated: 2020-03-10

RoHS

China RoHS Certificate

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.
  • File Type: (PDF)
  • Updated: 8/1/2020

RoHS Certificate of Compliance

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.
  • File Type: (PDF)
  • Updated: 8/1/2020

REACH Statement

Company statement regarding REACH SVHC compliance
  • File Type: (PDF)
  • Updated: 8/1/2020

Simulation Models

HSPICE: 4Gb LPDDR4 Z00M

WT, UT, AT, IT, XT, Z00M Mobile LPDDR4 SDRAM, Die Rev. B
  • File Type: ZIP
  • Updated: 2019-04-19

IBIS: 4Gb Mobile LPDDR4 Z00M

WT, UT, AT, IT, XT, Z00M Mobile LPDDR4 SDRAM, Die Rev. B, 366b 8DP, 200b SDP, 200b DDP, 376b QDP
  • File Type: ZIP
  • Updated: 2019-07-26

Technical Notes

TN-00-08: Thermal Applications

This document describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2020-03-25

TN-42-02: LPDDR2 Dual Die Package to Single Die Package Migration

This technical note provides information to enable migration of a Micron 1Gb LPDDR2 product from a dual-die package to a single-die package.
  • File Type: PDF
  • Updated: 2014-12-18
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Customer Service Notes

CSN-33: Micron BGA Manufacturer's User Guide

Provides information to enable customers to easily integrate both leading-edge and legacy Micron's ball grid array (BGA) packages into their manufacturing processes. It is intended as a set of high-level guidelines and a reference manual describing typical package-related and manufacturing process-flow practices.
  • File Type: PDF
  • Updated: 2020-04-21

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2019-04-29
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