MT53D1024M32D4DT-053 AAT

Orderable parts

MT53D1024M32D4DT-053 AAT:D

Specs

  • Chipset Validation
    N/A
  • Cycle Time
  • Data Rate
    DDR4-3732
  • Density
    32Gb
  • FBGA Code
    D9WPS
  • Op. Temp.
    -40C to +105C
  • Part Status
    Production
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Technology
    LPDDR4
  • Width
    x32

Data Sheets

Production Data Sheet: 200b: x16/x32 Automotive LPDDR4/LPDDR4X SDRAM (Z11M)

MT53D512M16D1, MT53D512M32D2, MT53D1024M32D4
  • File Type: PDF
  • Updated: 2020-03-10

RoHS

China RoHS Certificate

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.
  • File Type: (PDF)
  • Updated: 8/1/2020

RoHS Certificate of Compliance

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.
  • File Type: (PDF)
  • Updated: 8/1/2020

REACH Statement

Company statement regarding REACH SVHC compliance
  • File Type: (PDF)
  • Updated: 8/1/2020

Simulation Models

HSPICE: 8Gb Mobile LPDDR4 Z11M

WT, UT, AT, IT, Z11M Mobile LPDDR4 SDRAM, Die Rev. D, 556b, 432b, 376b, 366b, 200b
  • File Type: ZIP
  • Updated: 2020-05-26

IBIS: 8Gb Mobile LPDDR4 Z11M

WT, UT, AT, IT, Z11M Mobile LPDDR4 SDRAM, Die Rev. D, 556b, 432b, 376b, 366b, 200b
  • File Type: ZIP
  • Updated: 2020-05-26

Technical Notes

TN-00-08: Thermal Applications

This document describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2020-03-25

TN-42-02: LPDDR2 Dual Die Package to Single Die Package Migration

This technical note provides information to enable migration of a Micron 1Gb LPDDR2 product from a dual-die package to a single-die package.
  • File Type: PDF
  • Updated: 2014-12-18
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Customer Service Notes

CSN-20: Wafer Packaging and Packaging Materials

Provides complete shipping and recycling information about each of the materials used for shipping Micron's products.
  • File Type: PDF
  • Updated: 2019-10-31

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2019-04-29
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