MT53B512M64D4NH-062 WT

Orderable parts

MT53B512M64D4NH-062 WT:C

Specs

  • Chipset Validation
    N/A
  • Cycle Time
  • Data Rate
    DDR4-3200
  • Density
    32Gb
  • FBGA Code
    D9TWN
  • Op. Temp.
  • Part Status
    Production
  • PLP
    No
  • PLP Start Date
    N/A
  • Technology
    LPDDR4
  • Width
    x64

RoHS

China RoHS Certificate

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.
  • File Type: (PDF)
  • Updated: 4/1/2019

RoHS Certificate of Compliance

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.
  • File Type: (PDF)
  • Updated: 4/1/2019

Simulation Models

Z01M HSPICE

Z01M Mobile LPDDR4 SDRAM, Die Rev. C
  • File Type: ZIP
  • Updated: 2017-03-15T05:00:00.0000000Z

Z01M IBIS

Z01M Mobile LPDDR4 SDRAM, Die Rev. C, SDP, DDP, QDP, 200b, 272b, 366b, 432b
  • File Type: ZIP
  • Updated: 2018-09-19T05:00:00.0000000Z

Technical Notes

TN-00-08: Thermal Applications

Describes some considerations in thermal applications for Micron memory devices
  • File Type: PDF
  • Updated: 2018-02-15T06:00:00.0000000Z

Bypass Capacitor Selection for High-Speed Designs

Describes bypass capacitor selection for high-speed designs.
  • File Type: PDF
  • Updated: 2011-03-23T05:00:00.0000000Z

Customer Service Notes

Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2018-10-12T05:00:00.0000000Z

ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05T05:00:00.0000000Z
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